Method and apparatus for molding thermosetting polymers onto substrates

ABSTRACT

An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of patent application Ser.No. 08/564,855, filed on Nov. 30, 1995 and now abandoned. The subjectmatter of this application is related to that of application Ser. Nos.08/920,195, 08/918,199, 08/918,215, 08/918,302 and 08/918,303, all ofwhich were filed on Aug. 25, 1997.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to apparatus and methods for moldingthermosetting polymers, and more particularly to apparatus and methodsfor molding thermosetting polymers onto substrates.

2. Background

The use of logos and other types of graphical display on articles ofclothing is widespread. To date, the use of such graphic media hasgenerally been limited to two dimensional flat display media such as,for example, silk screen. This presents many shortcomings to marketersof consumer goods. The present invention is directed to overcoming theseshortcomings.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, an apparatus formolding thermosetting polymer bodies onto substrates is provided thatincludes a die set for molding at least one body onto a substrate, aplaten for supporting and positioning a substrate, an actuator formoving the die set into and out of engagement with the substrate, and acontrol system for controlling the operation of the molding device. Thedie set further includes an input member for receiving and distributingat least one supply of polymer, and a mold for receiving thedistribution of at least one supply of polymer from the runner plate andmolding at least one body of the polymer onto a substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustration of an apparatus for molding three dimensionalbodies of silicone, or some other thermosetting polymer, onto articlesof clothing, or some other substrate;

FIG. 2 is an illustration of an apparatus for molding multi-coloredthree dimensional bodies of silicone, or some other thermosettingpolymer, onto a plurality of article of clothing, or some othersubstrates;

FIG. 3 is an illustration of an apparatus for molding three dimensionalbodies of silicone, or some other thermosetting polymer, onto an articleof clothing, or some other substrate;

FIG. 4 is another illustration of a preferred embodiment of an apparatusfor molding three dimensional bodies of silicone, or some otherthermosetting polymer, onto articles of clothing, or some othersubstrates;

FIG. 4a is a perspective view of the apparatus of FIG. 4 in a disengagedposition;

FIG. 4b is a perspective view of the apparatus of FIG. 4 in an engagedposition;

FIG. 4c is an alternative preferred embodiment of the apparatus of FIG.4 in which the manifold and runner plate are combined;

FIG. 5a is a front view of the manifold of FIG. 4;

FIG. 5b is a top view of the manifold of FIG. 5a;

FIG. 5c is a bottom view of the manifold of FIG. 5a;

FIG. 5d is a cross-sectional view of the manifold of FIG. 5a;

FIG. 6a is a front view of the runner plate of FIG. 4;

FIG. 6b is a top view of the runner plate of FIG. 6a;

FIG. 6c is a bottom view of the runner plate of FIG. 6a;

FIG. 6d is a cross-sectional view of the runner plate of FIG. 6aillustrating the nozzles used in the runner plate;

FIG. 6e illustrates an alternative preferred embodiment of the nozzle ofFIG. 6d;

FIG. 7a is a front view of the mold of FIG. 4;

FIG. 7b is a top view of the mold of FIG. 7a;

FIG. 7c is a bottom view of the mold of FIG. 7a;

FIG. 7d is a cross-sectional view of the mold of FIG. 7a illustratingthe mold cavities;

FIG. 7e illustrates an alternative preferred embodiment of the moldcavity of FIG. 7d;

FIG. 7f illustrates a particularly preferred embodiment of the mold ofFIGS. 7a-7e;

FIG. 7g illustrates a bottom view of the mold of FIG. 7f;

FIG. 7h illustrates an alternative preferred embodiment of the mold ofFIGS. 7a-7g;

FIG. 8a is an illustration of the die set of FIG. 4 in a disengagedposition;

FIG. 8b is an illustration of the die set of FIG. 4 in an engagedposition;

FIG. 8c is cross-sectional view of the die set of FIG. 8b illustratingthe cooperative interaction of the runner plate and mold with the dieset in the engaged position;

FIG. 8d is an illustration of the die set of FIG. 4 in the disengagedposition including a preferred embodiment of the resilient guidemembers;

FIG. 8e is a fragmentary cross-sectional view of the die set of FIG. 8dillustrating the preferred embodiment of the resilient guide members;

FIG. 8f is an illustration of the die set of FIG. 8e in the engagedposition illustrating the preferred embodiment of the resilient guidemembers;

FIG. 9a is a top view of the platen of FIG. 4;

FIG. 9b is a preferred embodiment of the platen of FIG. 9a;

FIG. 10a is an illustration of the molding device of FIG. 4 in thedisengaged position;

FIG. 10b is an illustration of the molding device of FIG. 4 in theengaged position;

FIG. 11a is an illustration of an alternative preferred embodiment ofthe molding device of FIG. 4 in the engaged position;

FIG. 11b is an illustration of the die set of FIG. 11a;

FIG. 11c is a cross-sectional view of the die set of FIG. 11billustrating the interaction of the runner plate, insulating plate andmold;

FIG. 11d, is a cross-sectional view of an alternative embodiment of thedie set of FIG. 11b illustrating the cooperative interaction of theinsulating plate and mold;

FIG. 11e is an alternative preferred embodiment of the molding device ofFIG. 11a;

FIG. 11f is a cross-sectional view of a particularly preferredembodiment of the molding device of FIG. 11e;

FIG. 11g is an alternative preferred embodiment of the molding device ofFIG. 11e;

FIG. 11h is a cross-sectional view of a particularly preferredembodiment of the molding device of FIG. 11g;

FIG. 11i is a cross-sectional view of an alternative particularlypreferred embodiment of the molding device of FIGS. 11g and 11h;

FIG. 12a is an illustration of an alternative preferred embodiment ofthe manifold of FIG. 4;

FIG. 12b is an illustration of the flow control valve of the manifold ofFIG. 12a;

FIG. 12c is an illustration a preferred embodiment of the flow controlvalve of the manifold of FIG. 12b;

FIG. 12d is a cross-sectional view of the flow control valve of FIG.12c;

FIG. 12e is an exploded view of the flow control valve of FIG. 12c;

FIG. 12f is an illustration of a preferred embodiment of the annularmember of the flow control valve of FIG. 12c;

FIG. 13a is an illustration of another alternative preferred embodimentof the manifold of FIG. 4 including a flow control valve;

FIG. 13b is an illustration of an alternative preferred embodiment ofthe manifold of FIG. 13a;

FIG. 13c is a cross-sectional view of the manifold of FIG. 13b;

FIG. 13d is an illustration of an alternative preferred embodiment ofthe manifold of FIG. 13a;

FIG. 14a is an illustration of the dripping of silicone resin during themolding process;

FIG. 14b is an illustration of a preferred solution for the drippingproblem of FIG. 14a;

FIG. 15 is an illustration of a preferred embodiment of an apparatus formolding three dimensional bodies of thermosetting polymers onto aplurality of substrates using a plurality of supplies of thermosettingpolymer resins;

FIG. 16 is an illustration of a preferred embodiment of an apparatus forproviding a plurality of supplies of silicone resin, or some otherthermosetting polymer resin or resins;

FIG. 17a is an illustration of a preferred embodiment of a flow controlassembly for use in the apparatus of FIG. 16;

FIG. 17b is an illustration of an alternative preferred embodiment of aflow control assembly for use in the apparatus of FIG. 16;

FIG. 18a is an illustration of a preferred embodiment of a distributionchamber for use in the apparatus of FIG. 16;

FIG. 19a is an illustration of a preferred embodiment of a color blockfor use in the apparatus of FIG. 16;

FIGS. 20a and 20b are an illustration of a preferred embodiment of aninjector for use in the apparatus of FIG. 16;

FIG. 20c is a perspective illustration of a particularly preferredembodiment of the injector of FIG. 20a;

FIG. 21 is an illustration of a preferred embodiment of a control systemfor use in the apparatus of FIGS. 1, 2 and 15;

FIG. 22a is an illustration of a preferred method for molding aplurality of silicone bodies, or some other thermosetting polymer orpolymers, onto an article of clothing, or some other substrate;

FIG. 22b is a continued illustration of the preferred method for moldinga plurality of silicone bodies, or some other thermosetting polymer orpolymers, onto an article of clothing, or some other substrate;

FIG. 22c is an illustration of a particularly preferred method forstarting the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22d is an illustration of a particularly preferred method forstopping the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22e is an illustration of another particularly preferred method forstarting the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22f is an illustration of another particularly preferred method forstopping the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22g is an illustration of another particularly preferred method forstarting the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22h is an illustration of another particularly preferred method forstopping the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22i is an illustration of another particularly preferred method forstarting the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22j is an illustration of another particularly preferred method forstarting the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 22k is an illustration of another particularly preferred method forstopping the injection of silicone resin, or some other thermosettingpolymer resin;

FIG. 23a is an illustration of an article of clothing, or some othersubstrate, including a plurality of three dimensional bodies ofsilicone, or some other thermosetting polymer;

FIG. 23b is a front view of the article of clothing of FIG. 23aillustrating one of the three dimensional bodies;

FIG. 23c is a cross-sectional view of the article of clothing of FIG.23b illustrating the bonding of the silicone body, or some otherthermosetting polymer, to the article of clothing, or some othersubstrate;

FIG. 23d is an alternative preferred embodiment of the silicone body, orsome other thermosetting polymer, of FIG. 23c including an encapsulatedelement;

FIG. 24 is a perspective view of a silicone body, or some otherthermosetting polymer, affixed to a substrate and including a cavity;

FIG. 25a is an illustration of the formation of a skim coating of athermosetting polymer within a cavity of a mold;

FIG. 25b is a cross-sectional view illustrating the skim coating of FIG.25a;

FIG. 26 is an illustration of the insertion of an element device intothe cavity of the mold coated with the skim coating of FIGS. 25a and25b;

FIG. 27a is an illustration of the injection of silicone resin into thecavity including the element and skim coating of FIG. 26a to form asecondary body of silicone, or some other thermosetting polymer,including an encapsulated element;

FIG. 28a is an illustration of the application of an adhesion promoteronto a surface of the body of silicone, or some other thermosettingpolymer, of FIG. 27a;

FIG. 29a is an illustration of the insertion of the secondary body ofFIG. 28a into the cavity of the primary body of FIG. 24;

FIG. 30a is an illustration of the secondary body of FIG. 24 bonded tothe primary body of FIG. 28a;

FIG. 31a is an illustration of a preferred method of encapsulating anelement within a three dimensional body of silicone, or some otherthermosetting polymer;

FIG. 32a is an illustration of an alternative preferred method ofencapsulating an element within a three dimensional body of silicone, orsome other thermosetting polymer;

FIG. 33a is an illustration of an alternative preferred method ofencapsulating an element within a three dimensional body of silicone, orsome other thermosetting polymer; and

FIG. 33b is an illustration of a three dimensional body of silicone, orsome other thermosetting polymer, including encapsulated elements madeby the method illustrated in FIG. 33a.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A method and apparatus for molding silicone onto clothing is providedthat permits a plurality of multi-colored, three-dimensional bodies ofsilicone to be placed upon and permanently affixed to a plurality ofarticles of clothing. More generally, the method and apparatus may beapplied to the application of silicone moldings onto any substrate suchas, for example, paper, cardboard, wood, leather, wire mesh, sponge orfoam rubber. More generally still, the teachings of the presentdisclosure may also be applied to the application of three-dimensionalmolded bodies of any number of commercially available thermosettingpolymers such as, for example, silicone, nitrile rubber, or urethaneonto any substrate such as, for example, paper, cardboard, wood,leather, wire mesh, sponge or foam rubber. More generally still, theteachings of the present disclosure may be applied to the application ofa plurality of three dimensional bodies of a plurality of differenttypes of thermosetting polymers onto substrates such as, for example,silicone, nitrile rubber or urethane and nitrile rubber, silicone orurethane. Therefore, the disclosure of preferred embodiments for moldingthree dimensional bodies of silicone onto articles of clothing is meantto be illustrative and not limiting.

A method and apparatus for encapsulating elements within threedimensional bodies of silicone is also provided that permits one or moreelements to be encapsulated within a three dimensional body of silicone.More generally, the method and apparatus may be applied to theencapsulation of one or more elements into three dimensional bodies ofany number of thermosetting polymers such as, for example, silicone,urethane or nitrile rubber. Therefore, the disclosure of preferredembodiments for encapsulating elements into three dimensional bodies ofsilicone is intended to be illustrative and not limiting.

Referring initially to FIG. 1, an apparatus 10 for molding threedimensional bodies of silicone onto an article of clothing will now bedescribed. The apparatus 10 includes a silicone molding device 20, asilicone resin supply 30 and a control system 40. The apparatus 10permits a three-dimensional silicone body to be molded onto an articleof clothing, such as, for example, a pair of jeans, a shirt, a hat, or apurse, in order to display a trademark, logo, advertising, etc. Thisfurther permits the creation of textured surfaces. More generally, aswill be described below, the apparatus 10 permits a three-dimensionalbody of any thermosetting polymer to be molded onto substrates.

The silicone molding device 20 may comprise any number of conventionalsilicone molding devices, modified in accordance with the teachings ofthe present disclosure, adapted to mold three dimensional bodies ofsilicone onto articles of clothing. More generally, the molding device20 may comprise any number of conventional thermosetting polymer moldingdevices, modified in accordance with the teachings of the presentdisclosure, adapted to mold three dimensional bodies of thermosettingpolymer onto substrates.

The silicone resin supply 30 may comprise any number of conventionalsilicone resin supplies, modified in accordance with the teachings ofthe present disclosure, and adapted to provide a controlled amount ofsilicone resin to the silicone molding device 20. The silicone resinsupply 30 provides a controlled supply of silicone resin, or otherthermosetting polymer resin, to the silicone molding device 20 using aconventional supply conduit 50. In a preferred embodiment, the siliconeresin supply 30 will comprise a plurality of silicone supplies tothereby permit the molding device 20 to simultaneously mold a pluralityof silicone bodies of a plurality of colors onto an article of clothing.Examples of such silicones include at least the following: GE LIM 3745,GE LIM 6030, GE LIM 6045, GE LIM 6050 and GE LIM 6745, all commerciallyavailable from General Electric, Silicone Products Division, Waterford,N.Y.

Alternatively, and more generally, the silicone resin supply 30 willinstead provide a controlled amount of any number of commerciallyavailable thermosetting polymer resins such as, for example, silicone,urethane, or nitrile rubber to the molding device 20.

Alternatively, and more generally, the silicone resin supply 30 willcomprise a plurality of resin supplies and will simultaneously provide aplurality of thermosetting polymer resins such as, for example,silicone, urethane or nitrile rubber to the molding device 20.

The control system 40 may comprise any number of conventionalprogrammable general purpose computers or controllers, modified inaccordance with the teachings of the present disclosure. The controlsystem 40 communicates with, monitors and controls the operation of thesilicone molding device 20 and the silicone resin supply 30 usingconventional communications busses 60 and 70 using conventionalcommunication protocols.

Alternatively, the control system 40 may comprise hard-wired logicadapted to provide control of the various elements of the embodiments ofthe present disclosure. Alternatively, the control system 40 maycomprise manual control by one or more operators of the embodiments ofthe present disclosure. Alternatively, the control system 40 maycomprise any combination of programmable control, hard-wired logic, andmanual operator control adapted to provide control of the variouselements of the embodiments of the present disclosure.

More generally, in a particularly preferred embodiment, referring now toFIG. 2, the apparatus 10 for molding three dimensional bodies ofsilicone onto articles of clothing includes a plurality of moldingdevices or stations 20₁ to 20_(N), a plurality of supplies of siliconeresin 30₁ to 30_(M), and a control system 40. In this manner, theapparatus 10 is able to substantially simultaneously mold a plurality ofthree dimensional bodies of silicone onto a plurality of articles ofclothing. Furthermore, the plurality of supplies of silicone resin 30 ofthe apparatus 10 permit a plurality of colors of silicone to be providedto each of the molding devices or stations 20. Consequently, a differentmix of colors can be provided to each molding device or station 21permitting a different pattern of three dimensional silicone bodies tobe molded onto articles of clothing at each molding device or station21. Thus, the apparatus 10 provides a flexible and easily programmableand reconfigurable device for molding three dimensional silicone bodiesonto articles of clothing for use in displaying such material astrademarks, logos or advertising on articles of clothing such as shirts,pants, hats, purses, etc. . . .

More generally, the apparatus 10 may be utilized to mold a plurality ofthree dimensional bodies of any number of commercially availablethermosetting polymers substantially simultaneously onto a plurality ofsubstrates. More generally still, the apparatus 10 may be utilized tomold a plurality of three dimensional bodies of a plurality of differenttypes of thermosetting polymers substantially simultaneously onto aplurality of substrates.

Referring now to FIGS. 3, 4, 4a and 4b, a preferred embodiment of amolding device or station 20 will be described. The molding device 20includes an actuator 310, a die set 320 and a platen 330. In operation,the molding device 20 molds at least one three dimensional body ofsilicone onto a garment or article of clothing 340. Examples of suchsilicone materials include at least the following: GE LIM 3745, GE LIM6030, GE LIM 6045, GE LIM 6050 and GE LIM 6745, all commerciallyavailable from General Electric, Silicone Products Division, Waterford,N.Y.

More generally, the molding device 20 may be used to mold at least onethree dimensional body of a thermosetting polymer such as, for example,silicone, urethane, or nitrile rubber onto a substrate such as, forexample, cloth, paper, cardboard, wood, leather, wire mesh, sponge orfoam rubber.

More generally still, the molding device 20 may be used to mold aplurality of three dimensional bodies of a plurality of types ofthermosetting polymers, such as, for example, silicone, urethane ornitrile rubber and nitrile rubber, silicone or urethane onto a substratesuch as, for example, cloth, paper, wood, leather, wire mesh, cardboard,sponge or foam rubber. In this manner, thermosetting polymers havingsimilar time and temperature curing profiles may be simultaneouslymolded onto substrates.

The actuator 310 controllably moves the die set 320 into and out ofengagement with the garment 340 under the control of the control system40. The actuator may comprise any number of conventional actuators suchas, for example, pneumatic, hydraulic or electromechanical actuators.The movement of the actuator 310 may be controlled using a combinationof any number of conventional feedback control sensors and algorithmssuch as, for example, proportional-integral-differential. In a preferredembodiment, the actuator 310 is a hydraulic actuator model no.DIVW4CWSWF, including pressure feedback to prevent damage to the articleof clothing 340 during engagement with the die set 320, available fromParker-Hannifin located in Elyria, Ohio. In this manner, delicatearticles of clothing 340 are not damaged during engagement with the dieset 320. In a particularly preferred embodiment, the contact pressure ofthe die set 320 with the article of clothing 340 is limited to the rangeof about 50 to 300 psi. Alternatively, and more generally, the preferredrange of contact pressures will vary as a function of the particulartype and thickness of the substrate 340.

During engagement of the die set 320 with the article of clothing 340,the die set 320 receives at least one supply of silicone resin from thesilicone resin supply 30, molds at least one body of silicone onto thearticle of clothing 340, cures at least one body of silicone onto thearticle of clothing 340, and disengages from the article of clothing 340under the control of the control system 40. The die set 320 may compriseany number of conventional die sets for molding thermosetting polymersonto substrates, modified in accordance with the teachings of thepresent disclosure.

In a preferred embodiment, as illustrated in FIGS. 4, 4a and 4b, he dieset 320 includes a manifold 405, a runner plate 410, one or moreresilient guide members 415, and a mold 420. During engagement of thedie set 320 with the article of clothing 340, the manifold 405 receivesat least one supply of silicone resin from the silicone resin supply 30and transmits it to the runner plate 410. The runner plate 410 in turnreceives at least one supply of silicone resin from the manifold 405 anddistributes at least one supply of silicone resin to the mold 420. Themold 420 in turn receives the distribution of at least one supply ofsilicone resin and forms and molds at least one three dimensional bodyof silicone onto the garment 340. Examples of such silicone resinsinclude at least the following: GE LIM 3745, GE LIM 6030, GE LIM 6045,GE LIM 6050 and GE LIM 6745, all commercially available from GeneralElectric, Silicone Products Division, Waterford, N.Y.

Alternatively, during engagement of the die set 320 with the article ofclothing 340, the manifold 405 may receive at least one supply of athermosetting polymer resin such as, for example, silicone, urethane ornitrile rubber from the silicone resin supply 30 and transmit it to therunner plate 410.

Alternatively, and more generally, during engagement of die set 320 withthe article of clothing 340, the manifold 405 may receive supplies of aplurality of different types of thermosetting polymer resins such as,for example, silicone, urethane or nitrile rubber and nitrile rubber,silicone or urethane from the silicone resin supply 30 and transmit itto the runner plate 410. In this manner, thermosetting polymers havingsimilar time and temperature curing profiles may be simultaneouslymolded onto a substrate.

The resilient guide members 415 resiliently couple the runner plate 410and the mold 420. As illustrated in FIGS. 4a and 4b, during engagementof the die set 320 with the garment 340, the resilient members 415deflect and permit the runner plate 410 to cooperatively interact withthe mold 420 thereby permitting the passage of silicone from the runnerplate 410 to the mold 420. Otherwise, the resilient guide members 415thermally isolate the runner plate 410 from the mold 420. In thismanner, heat transfer between mold 420 and the manifold 405 and runnerplate 410 are minimized to prevent curing of silicone within themanifold 405 and runner plate 410 during operation of the molding device20. In a preferred embodiment, a plurality of such resilient guidemembers 415 are employed to provide even resilient force.

In an alternative preferred embodiment, as illustrated in drawing FIG.4c, the manifold 405 and runner plate 410 of drawing FIG. 4 are combinedinto a combined manifold/runner plate 425 in order to both reduce thenumber of parts in the die set 320 and permit the transmission anddistribution of greater numbers of silicone resin supplies resulting ingreater silicone resin pressures. In this alternative preferredembodiment, the flow passages are formed in a single body usingconventional fabrication processes. In a preferred embodiment, the flowpassages are formed using investment casting and CNC machining. In apreferred embodiment, the combined manifold/runner plate 425 is furthermodified to incorporate the various enhancements of the preferredembodiments of the manifold 405 and runner plate 410 described below.

In a preferred embodiment, as illustrated in FIGS. 5a-5d, the manifold405 includes a plurality of silicone resin inlet passages 505a-505c, aplurality of corresponding silicone outlet passages 510a-510c, a coolingelement 515, and a temperature sensor 520.

Each of the silicone resin inlet passages 505a-505c receive a supply ofsilicone resin from a corresponding silicone resin supply 30 and conveythe silicone supply to corresponding silicone resin outlet passages510a-510c. The silicone resin supply 30 may comprise one or moresilicone supplies. In this manner, each of the silicone resin inletpassages 505a-505c may receive a different supply of silicone resin. Thesilicone resin outlet passages 510a-510c in turn communicate withcorresponding silicone resin inlet passages located within the runnerplate 410. In this manner, the manifold 405 receives at least onesilicone supply and transmits at least one silicone supply to the runnerplate 410.

Alternatively, the manifold 405 may receive at least one supply of athermosetting polymer such as, for example, silicone, nitrile rubber orurethane for transmission to the runner plate 410. Alternatively, andmore generally, the manifold 405 may substantially simultaneouslyreceive supplies of a plurality of different types of thermosettingpolymers for transmission to the runner plate 410 such as, for example,silicone, urethane or nitrile rubber and urethane, nitrile rubber orsilicone. In this manner, thermosetting polymers having similar time andtemperature curing profiles may be simultaneously molded ontosubstrates.

The silicone resin inlet passages 505a-505c are contained within thebody of the manifold 405. The silicone resin inlet passages 505a-505care defined by openings positioned in one or more sides of the body ofthe manifold 405 that extend into the body of the manifold 405. In aparticularly preferred embodiment, the silicone resin inlet passages505a-505c extend from openings formed in one or more side surfaces 525of the body of the manifold 405. The silicone resin inlet passages505a-505c are preferably positioned substantially normal to thedirection of the silicone resin outlet passages 510a-510c. Thecross-sectional shape of the silicone resin inlet passages 505a-505c arepreferably substantially circular.

The cross-sectional areas of the silicone inlet passages 505a-505c mayrange, for example, from about 0.010 to 10 square inches for typicalsilicone materials to provide improved flow characteristics. In apreferred embodiment, the cross-sectional areas of the silicone resininlet passages 505a-505c range from about 0.100 to 1 square inches inorder to provide optimum flow characteristics for typical siliconematerials. The preferred physical characteristics will differ dependingupon the types of thermosetting polymers employed.

The silicone resin outlet passages 510a-510c are contained within thebody of the manifold 405. The silicone resin outlet passages 510a-510cextend from corresponding silicone resin inlet passages 510a-510c toopenings in a bottom face 530 of the body of the manifold 405. Thesilicone resin outlet passages 510a-510c may include one or morepassages. In a preferred embodiment, a plurality of substantially evenlydistributed silicone resin outlet passages 510-510c are providedextending substantially perpendicular to a side face 525 of the manifold405. In this manner, the manifold 405 may be used with any runner plate410 by virtue of its modular design that will accommodate differentconfigurations of runner plate silicone resin inlet passages.

The cross-sectional areas of the silicone resin outlet passages510a-510c may range, for example, from about 0.010 to 10 square inchesfor typical silicone materials to provide improved flow characteristics.In a preferred embodiment, the cross-sectional areas of the siliconeresin outlet passages 510a-510c range from about 0.100 to 1 squareinches to provide optimum flow characteristics for typical siliconematerials. The preferred physical characteristics will differ dependingupon the types of thermosetting polymers employed.

The silicone inlet passages 505a-505c and the silicone resin outletpassages 510a-510c may be formed in the manifold 405 using any number ofconventional fabrication processes. In a preferred embodiment, thesilicone resin inlet passages 505a-505c and silicone resin outletpassages 510a-510c are formed in the manifold 405 by CNC machining.

The cooling element 515 controllably maintains the operating temperatureof the manifold 405 within a predetermined range of temperatures. In apreferred embodiment, for typical grades of silicone, the coolingelement 515 maintains the operating temperature of the manifold 405between approximately 55 and 60° F. For typical grades of siliconeresins, this preferred range of operating temperatures provides asilicone material having a paste-like quality that in turn minimizesunwanted flow and dripping of the silicone material within the die set320. The preferred operating temperature ranges will differ dependingupon the types of thermosetting polymers employed.

In a preferred embodiment, the cooling element 515 is a fluid passagelocated within the body of the manifold 405 that conveys a cooling fluidsuch as, for example, water through the body of the manifold 405 tocontrol the operating temperature of the manifold 405. In a preferredembodiment, the molding device 20 further includes a water coolingdevice 535 that provides a controlled supply of water, or other coolingfluid, for passage through the cooling element 515. In a preferredembodiment, the cooling device 535 is a Thermal Transfer RC Series ModelNo. RC 0.75-RC2, available from Thermal Transfer Products, Ltd. inBuffalo, N.Y. In a particularly preferred embodiment, the output signalfrom a conventional temperature sensor 520 is then utilized by thecontrol system 40 to provide feedback control of the operatingtemperature of the manifold 405 using a conventional control algorithm.

In the preferred embodiment, the fluid passage of the cooling element515 may be formed in the body of the manifold 405 by brazing a thermallyconductive fluid conduit onto a surface of the manifold 405. In aparticularly preferred embodiment, the fluid passage of the coolingelement 515 is formed in the body of the manifold 405 by investmentcasting.

The manifold 405 may be fabricated from any number of conventionalthermally conductive materials such as, for example, aluminum. Themanifold 405 may be fabricated using any number of conventionalfabrication processes such as, for example, computer controlledmachining. In a preferred embodiment, the manifold is fabricated fromaluminum by the process of CNC machining.

In a preferred embodiment, as illustrated in FIGS. 6a-6d, the runnerplate 410 includes a plurality of silicone resin inlet passages605a-605c, a plurality of corresponding silicone resin distributionchannels 610a-610c, a plurality of corresponding silicone resin outletpassages 615a-615c, and a plurality of corresponding silicone resinoutlet nozzles 620a-620c.

The silicone resin inlet passages 605a-605c of the runner plate 410receive silicone resin from the corresponding silicone resin outletpassages 510a-510c of the manifold 405. The silicone resin inletpassages 605a-605c transmit silicone resin to corresponding siliconeresin distribution channels 610a-610c. The silicone resin distributionchannels 610a-610c are necessitated by the particular configuration ofthe mold cavities of the mold 420. The silicone resin distributionchannels 610a-610c transmit silicone resin to corresponding siliconeresin outlet passages 615a-615c. The silicone resin outlet passages615a-615c transmit silicone resin to corresponding mold cavities withinthe mold 420. The transmission of silicone from the silicone resinoutlet passages 615a-615c to the mold cavities of the mold 420 isfacilitated by the silicone resin outlet nozzles 620a-620c that extendfrom a bottom surface 625 of the runner plate 410 and into complementaryshaped silicone resin inlet passages within the mold 420.

The silicone resin inlet passages 605a-605c are contained within thebody of the runner plate 410. The silicone resin inlet passages605a-605c are defined by openings positioned in a top face 630 of therunner plate 410 that extend into the body of the runner plate 410. Thesilicone resin inlet passages 605a-605c preferably extend substantiallynormal to the top face 630 of the runner plate 410. The silicone resininlet passages 605a-605c of the runner plate 410 are preferably largerin cross-section than the corresponding silicone resin outlet passages510a-510c of the manifold 405. In operation, the die set 320 isassembled with bottom face 530 of the manifold 405 in intimate contactwith the top face 630 of the runner plate 410. In this manner, siliconeresin passes from the silicone resin outlet passages 510a-510c of themanifold 405 to the corresponding silicone resin inlet passages605a-605c of the runner plate 410.

The cross-sectional areas of the silicone inlet passages 605a-605c mayrange, for example, from about 0.001 to 10 square inches for typicalsilicone materials to provide improved flow characteristics. In apreferred embodiment, the cross-sectional areas of the silicone resininlet passages 605a-605c range from about 0.100 to 1 square inches inorder to provide optimum flow characteristics for typical siliconematerials. The preferred physical characteristics will differ dependingupon the types of thermosetting polymers employed.

The silicone resin distribution passages 610a-610c are contained withinthe body of the runner plate 410. The silicone resin distributionpassages 610a-610c extend from the silicone resin inlet passages605a-605c to the silicone resin outlet passages 615a-615c. In thismanner, the silicone resin distribution channels 610a-610c transmitsilicone resin from corresponding silicone resin inlet passages605a-605c to corresponding silicone resin outlet passages 615a-615c. Thesilicone resin distribution passages 610a-610c are preferably defined bychannels positioned and formed in the top face 630 of the runner plate410 that extend into the body of the runner plate 410. In operation, thedie set 320 is assembled with bottom face 530 of the manifold 405 inintimate contact with the top face 630 of the runner plate 410.Therefore, in the preferred embodiment, the silicone resin distributionchannels 610a-610c are defined by the channels formed in the top face630 of the runner plate 410 and the bottom surface 530 of the manifold405.

The cross-sectional areas of the silicone resin distribution passages610a-610c may range, for example, from about 0.010 to 10 square inchesfor typical silicone materials to provide improved flow characteristics.In a preferred embodiment, the cross-sectional areas of the siliconeresin inlet passages 610a-610c range from about 0.100 to 1 square inchesin order to provide optimum flow characteristics for typical siliconematerials. The preferred physical characteristics will differ dependingupon the types of thermosetting polymers employed.

The silicone resin outlet passages 615a-615c are contained within thebody of the runner plate 410. The silicone resin outlet passages615a-615c are defined by openings positioned in the bottom face 625 ofthe runner plate 410 that extend into the body of the runner plate 410.The silicone resin outlet passages 615a-615c preferably extendsubstantially normal to the bottom face 625 of the runner plate 410. Thesilicone resin outlet passages 615a-615c of the runner plate 410 arepreferably smaller in cross-section than the corresponding siliconeresin distribution passages 610a-610c. In operation, during engagementof the die set 320 with the garment 340, the bottom face 625 of therunner plate is placed in intimate contact with a top face of the mold420. In this manner, silicone resin passes from the silicone resinoutlet passages 615a-615c of the runner plate 410 to the correspondingsilicone resin inlet passages of the mold 420.

The cross-sectional areas of the silicone resin outlet passages615a-615c may range from about 0.010 to 10 square inches for typicalsilicone materials to provide improved flow characteristics. In apreferred embodiment, the cross-sectional areas of the silicone resinoutlet passages 615a-615c range from about 0.100 to 1 square inches inorder to provide optimum flow characteristics for typical siliconematerials. The preferred physical characteristics will differ dependingupon the types of thermosetting polymers employed.

In a particularly preferred embodiment, that transmission of siliconeresin from the silicone resin outlet passages 615a-615c to thecorresponding silicone resin inlet passages of the mold 420 isfacilitated by the silicone resin outlet nozzles 620a-620c. Asillustrated in FIGS. 6a and 6d, the silicone resin outlet nozzles620a-620c extend from the bottom face 625 of the runner plate 410. Inoperation, during engagement of the die set 320 with the garment 340,the silicone resin outlet nozzles 620a-620c cooperatively interact withcomplementary shaped silicone resin inlet passages in a top face of themold 420. The silicone resin outlet nozzles 620a-620c may be formed asintegral parts of the runner plate using conventional fabricationprocesses. In a preferred embodiment, the silicone resin outlet nozzles620a-620c are separable from the runner plate 410 and comprised of adurable material having a reduced thermal conductivity such as, forexample, beryllium copper or ceramic. In this manner, heat transfer fromthe mold 420 during engagement with the runner plate 410 is reduced tothereby minimize or prevent the curing of silicone resin within the flowpassages of the runner plate 410 and manifold 405.

In an alternative preferred embodiment, as illustrated in FIG. 6e, athermal insulating element 635 is added that substantially circumscribesthe silicone outlet nozzle 620 to further minimize heat transfer fromthe mold 420 to the runner plate 410 during engagement of the die set320 with the garment 340. In a preferred embodiment, the thermalinsulating element 635 is fabricated from nitrile rubber.

The runner plate 410 may be fabricated from any number of durablematerials such as, for example, aluminum, copper, brass, steel, ceramic,or composite materials. In a preferred embodiment, the runner plate 410is fabricated from aluminum. The runner plate may be fabricated usingany number of conventional fabrication processes. In a preferredembodiment, the runner plate 410 is fabricated by CNC machining.

The resilient guide members 415 resiliently couple the runner plate 410to the mold 420. The resilient guide members 415 further maintain thealignment of the mold 420 with respect to the runner plate 410.

In a preferred embodiment, as illustrated in drawing FIGS. 8d-8f, thedie set 320 includes a plurality of resilient guide members 415positioned about a periphery of the runner plate 410 and mold 420. Inthe preferred embodiment, each of the resilient members 415 include aguide post 850 and a spring member 855. The guide posts 850 arepositioned within and extend from a recess 860 formed in the top surface725 of the mold 420. The spring members 855 are coupled to a base of therecess 860 and to the bottom surface 625 of the runner plate positionedabove the recess 860. The guide posts 850 also extend at least partiallyinto corresponding guide holes 865 formed in the bottom surface 625 ofthe runner plate 410. During engagement of the die set 320, the springmembers 855 are compressed into the recess 860 and the guide posts 850slide into the corresponding guide holes 865. During disengagement ofthe die set 320, the spring member 855 force the mold 420 away from therunner plate 410.

During operation of the molding device 20, the resilient guide members415 maintain a gap between the runner plate 410 and the mold 420 of atleast about 3 inches during disengagement of the die set 320 with thearticle of clothing. In this manner, the resilient members 415 minimizeheat transfer from the mold 420 to the runner plate 410 therebyminimizing or eliminating curing of silicone resin within the runnerplate 410 and manifold 405. Alternatively, more generally, the resilientguide members 415 minimize heat transfer from the mold 420 to the runnerplate 410 thereby minimizing or eliminating curing of thermosettingpolymer resins within the runner plate 410 and manifold 405.

In a preferred embodiment, as illustrated in FIGS. 7a-7d, the mold 420includes a plurality of silicone resin inlet passages 705a-705c, aplurality of corresponding mold cavities 710a-710c, a heating element715, and a temperature sensor 720. The silicone resin inlet passages705a-705c of the mold 420 receive silicone resin from the correspondingsilicone resin outlet passages 615a-615c of the runner plate 410. Thesilicone resin inlet passages 705a-705c transmit silicone resin tocorresponding mold cavities 710a-710c. The heating element 715 cures thesilicone resin bodies formed by the mold cavities of the mold 420. Thetemperature sensor 720 permits feedback control of the operatingtemperature range of the mold 420.

The silicone resin inlet passages 705a-705c are contained within thebody of the mold 420. The silicone resin inlet passages 705a-705c aredefined by openings positioned in a top face 715 of the mold 420 thatextend into the body of the mold 420. The silicone resin inlet passages705a-705c preferably extend substantially normal to the top face 725 ofthe mold 420. In a preferred embodiment, the silicone resin inletpassages 705a-705c of the mold 420 are complementary shaped openingsadapted to receive the silicone resin outlet nozzles 620a-620c of therunner plate 410.

In the preferred embodiment, as illustrated in FIGS. 8a-8c, duringengagement of the die set 320 with the article of clothing 340, thesilicone resin outlet nozzles 620a-620c of the runner plate 410cooperatively interact with the complementary shaped correspondingsilicone resin inlet passages 705a-705c of the mold 420. In this manner,silicone resin passes from the silicone resin outlet passages 615a-615cof the runner plate 410 to the corresponding silicone resin inletpassages 705a-705c and mold cavities 710a-710c of the mold 420.

In a particularly preferred embodiment, as illustrated in drawing FIGS.8a-8c, the extension of the silicone resin outlet nozzles 620a-620c ofthe runner plate 410 into the silicone resin inlet passages 705a-705c ofthe mold 420 positions the tangential plane of the lower face 805 of thenozzles 620a-620c substantially coincident with the tangential plane ofthe upper inner surface 810 of the mold cavity 710 of the mold 420. Inthis manner, the top surface of the molded three dimensional body ofsilicone is substantially smooth.

In a particularly preferred embodiment, the mold cavities 710 of themold 420 are formed by first forming the silicone resin inlet passages705, inserting silicone resin inlet nozzles 620 into the silicone resininlet passages 705, and then CNC machining the mold cavities 710. Inthis manner, the tangential planes of the upper inner surfaces 810 ofthe mold cavities 710 are made substantially exactly coincident with thetangential lower planes of the lower faces 805 of the nozzles 620.

The cross-sectional areas of the silicone inlet passages 705a-605c mayrange, for example, from about 0.010 to 10 square inches for typicalsilicone materials to provide improved flow characteristics. In apreferred embodiment, the cross-sectional areas of the silicone resininlet passages 705a-705c range from about 0.100 to 1 square inches inorder to provide optimum flow characteristics for typical siliconematerials. In a particularly preferred embodiment, the cross-sectionalareas of the various flow passages of the die set 320 are madesuccessively smaller in the flow path starting with the silicone resininlet passages 505 of the manifold 405 and ending with the siliconeresin outlet passages 615 of the nozzles 620. The preferred physicalcharacteristics will differ depending upon the types of thermosettingpolymers employed.

During operation of the molding device 20, the mold cavities 710a-710creceive the silicone resin supply from the corresponding silicone resininlet passages 705a-705c. The silicone resin fills the cavities710a-710c and forms the three dimensional bodies of silicone resin onthe top surface of the article of clothing 340. The heating element 715then cures the silicone resin bodies formed by the mold cavities710a-710c. Because the fabric used in conventional articles of clothing340 is porous, at least some portion of the silicone resin willpenetrate through to the bottom surface of the article of clothing 340.As will be described below, a heater positioned in the platen 330 curesthis silicone resin and forms a skim coating of cured silicone on thebottom surface of the article of clothing. In this manner, further bleedthrough of silicone resin, or other thermosetting polymer resin throughporous substrates, is prevented.

The mold 420 may include any number of mold cavities 710 depending uponthe complexity of the particular graphical design to be affixed to thearticle of clothing 340. Furthermore, one or more of the silicone bodiesformed may be comprised of different colors of silicone. The surfacetexture of the silicone bodies may be smooth or textured. As illustratedin FIG. 7e, texturing of the silicone body may be provided by adjustingthe surface texture of the inner surface 730 of the mold cavity 710.

The heating element 715 may comprise any number of conventional heatingelements such as, for example, electrical heaters. In a preferredembodiment, the heating element 715 is a cal rod available from theWatlow Corporation. In a particularly preferred embodiment, a pluralityof such cal rod heaters are used and are positioned substantially evenlybetween and among the mold cavities 710 of the mold 420 in order toevenly distribute thermal energy within the mold 420.

The temperature sensor 720 may comprise any number of conventionaltemperature sensors such as, for example, thermocouple or thermistor. Ina preferred embodiment, the temperature sensor 720 is a thermocoupleavailable from Pyromation, Inc. In a particularly preferred embodiment,the temperature sensor 720 generates a signal representative of anoperating temperature of the mold 420 that is processed by the controlsystem 40 to control the operation of the heating element 715 tomaintain the operating temperature of the mold 420 within apredetermined range of temperatures. The predetermined range of theoperating temperatures of the mold 420, for typical types and grades ofsilicone resin, may range, for example, from approximately 75 to 500° F.In a preferred embodiment, the predetermined range of operatingtemperatures of the mold 420, for typical types and grades of siliconeresins, ranges from about 150 to 300° F. The desired range of operatingtemperatures will differ depending upon the types of thermosettingpolymers employed.

The mold 420 may be fabricated from any number of durable and thermallyconductive materials such as, for example, aluminum, copper, brass,steel, or composite materials. In a preferred embodiment, the mold 420is fabricated from aluminum. The mold cavities 710a-710c of the mold 420may be fabricated using any number of conventional fabricationprocesses. In a preferred embodiment, the mold cavities 710a-710c arefabricated by CNC machining.

In an alternative preferred embodiment of the mold 420, as illustratedin drawing FIGS. 7f and 7g, raised borders 750a-750c are provided abouta periphery of each of the mold cavities 710a-710c that extend outwardfrom the bottom surface 755 of the mold 420. The raised borders750a-750c minimize the contact area between the mold 420 and the articleof clothing 340, thereby minimizing possibly damaging heat transfer tothe article of clothing 340. The thickness T and height H of the raisedborders 750a-750c may range, for example, from about 0.25 to 1.5millimeters 0.02 to 9 millimeters respectively. In a preferredembodiment, the thickness T and height H of the raised borders 750a-750crange from about 0.50 to 0.75 millimeters and 0.50 to 6 millimetersrespectively. The preferred range of the thickness T and height H of theraised borders 750a-750c will vary as a function of the size andconfiguration of the mold cavities 710a-710c and the type and thicknessof the substrate.

In an alternative preferred embodiment of the mold 420, as illustratedin FIG. 7h, the heater 715 is removed from the mold 420 and a separatehot plate 760 is provided in the die set 320 that is positionedimmediately above the mold 420. The hot plate 760 maintains theoperating temperature of the mold 420 within the predetermined range ofoperating temperatures as discussed above. In this manner, the designand construction of the mold 420 is simplified thereby making it lessexpensive to manufacture. For example, the physical size of the mold 420can be made much smaller than the physical size of the heating elements.The mold 420 and hot plate 760 are preferably fabricated from thermallyconductive materials such as, for example, aluminum, brass, steel orcomposite materials to facilitate the conduction of thermal energy fromthe hot plate 760 to the mold 420.

The hot plate 760 includes a plurality of flow passages 765a-765c andheating elements 770a-770d. The flow passages 765a-765c are fluidiclycoupled and correspond to the inlet passages 705a-705c of the mold 420.In this manner, the flow passages 765a-765c convey silicone resin fromthe manifolds 405, 425 and 1140 and runner plate 410 to the mold 420.The heating elements 770a-770d provide thermal energy and may compriseany number of conventional heating elements such as, for example,electrical heaters or cal rods. In a preferred embodiment, the heatingelements 770a-770d are cal rods, available from the Watlow Corporation.In a particularly preferred embodiment, the heating elements 770a-770dare distributed among and between the flow passages 765a-765c in orderto provide a substantially even distribution of thermal energy. Theoperating temperature of the mold 420 is preferably controlled by thecontrol system 40 which monitors the temperature of the mold using thetemperature sensor 720. The control system 40 then preferably controlsthe operation of the heating elements 770a-770d to maintain theoperating temperature of the mold 420 within a predetermined range oftemperatures.

In a particularly preferred embodiment, the flow passages 765a-765c ofthe hot plate 760 are further modified to cooperatively interact withflow nozzles provided in the runner plate 410, manifolds 405, 425 and1140, or insulator plate 1105.

In a preferred embodiment, as illustrated in FIG. 9a, the platen 330includes a platen body 905, a heating element 910 and a cooling element915. The platen body 905 supports and positions the article of clothing340, or other substrate, during engagement with the die set 320 of themolding device 20. In particular, during engagement of the die set 320with the top surface of the article of clothing 340, the heating element915 cures the silicone material that passes into and through the articleof clothing 340 to form a skim coating of silicone on the bottom surfaceof the article of clothing 340. In a particularly preferred embodiment,the skim coating is formed within the fabric of the article of clothing.In this manner, further bleed-through of silicone resin, or otherthermosetting polymer resin, through the article of clothing 340 isprevented. The cooling element 915 protects the remaining portions ofthe article of clothing 340 that do not interact with the die set 320from the heat generated by both the die set 320 and the platen heatingelement 910.

The platen body 905 supports and positions the article of clothing 340during engagement with the die set 320. The platen body 905 ispreferably includes a substantially planar upper surface that directlysupports the article of clothing 340. The platen body 905 alsopreferably includes at least one reference surface to provide properpositioning of the article of clothing 340 relative to the die set 320.The platen body 905 may be fabricated from any number of durablematerials such as, for example, aluminum or steel. In a preferredembodiment, the platen body 905 is fabricated from aluminum. In theexemplary embodiment, illustrated in FIG. 9a, the platen body 905 isdesigned to support and position a T-shirt. In the exemplary embodiment,the T-shirt fits over the platen with a part of shoulder surfaces 920aand 920b providing reference surfaces to provide proper positioning ofthe T-shirt 340 relative to the die set 320. For different types ofsubstrates, different reference surfaces will be provided.

The heating element 910 is provided within the platen body 905 andmaintains the area in the immediate vicinity of the lower surface of thematerial of the article of clothing 340 that engages the die set 320 ata controlled range of predetermined temperatures. For typical types andgrades of silicone resin, the heating element 910 maintains the area inthe vicinity of the lower surface of the material of the article ofclothing 340 that engages the die set 320 at temperatures ranging from,for example, about 100 to 500° F. In a preferred embodiment, for typicalgrades and types of silicone resin, the heating element 910 maintainsthe area in the vicinity of the lower surface of the material of thearticle of clothing 340 that engages the die set 320 at temperaturesranging from about 250 to 400° F. The preferred operating temperaturerange will differ depending upon the types of substrates andthermosetting polymer resins employed. In a particularly preferredembodiment, the outer peripheral circumference of the heating element910 is wrapped with an insulating material 960 such as, for example,fiberglass insulation in order to minimize heat transfer from theheating element 910 to the remaining outer portions of the platen body905.

The heating element 910 may comprise any number of conventional heatingelements such as, for example, electrical heater or cal rod. In apreferred embodiment, the heating element 910 comprises a plurality ofcal rods, available from the Watlow Corp., substantially evenlydistributed to provide even heating. In a particularly preferredembodiment, the platen 330 further includes a platen heating elementtemperature sensor 925 that generates a signal representative of anoperating temperature of the heating element 910. The temperature sensor925 may comprise any number of conventional temperature sensors such as,for example, a thermistor or thermocouple. In the particularly preferredembodiment, the control system 40 receives and processes the temperaturesignal generated by the temperature sensor 925 to maintain the operatingtemperature of the heating element 910 within a predetermined range oftemperatures.

The size and configuration of the heating element 910 will be determinedby the size of the article of clothing 340 as well as the region withinthe top surface of the material of the article of clothing 340 that willengage the die set 320. Alternatively, the size and configuration of theheating element 910 will be determined by the size of the substrate 340as well as the region within the top surface of the material of thesubstrate 340 that will engage the die set 320.

The cooling element 915 is provided within the platen body 905 andmaintains the area in the immediate vicinity of the lower surface of thematerial of the article of clothing 340 that does not engage the die set320 at a controlled range of predetermined temperatures. For typicalmaterials, the cooling element 915 maintains the area in the vicinity ofthe lower surface of the material of the article of clothing 340 thatdoes not engage the die set 320 at temperatures, for example, rangingfrom about 45 to 70° F. In a preferred embodiment, for typical siliconematerials, the cooling element 915 maintains the area in the vicinity ofthe lower surface of the material of the article of clothing 340 thatdoes not engage the die set 320 at temperatures ranging from about 55 to60° F. In this manner, the cooling element 915 protects the portions ofthe article of clothing 340 that do not engage the die set 320 from heattransfer from the die set 320 and platen heating element 910. Thepreferred temperature range will differ depending upon the type ofsubstrate employed.

The cooling element 915 may comprise any number of conventional coolingelements such as, for example, conductive water cooling. In a preferredembodiment, the cooling element 915 comprises a water cooled region ofthe platen body 905 and the molding device 20 further includes a watercooling device 930. The water cooling device 930 provides a controlledsupply of water, or other coolant, for passage through the coolingelement 915. In a particularly preferred embodiment, the platen 330further includes a platen cooling element temperature sensor 935 thatgenerates a signal representative of an operating temperature of thecooling element 915. The temperature sensor 935 may comprise any numberof conventional temperature sensors such as, for example, a thermistor.In the particularly preferred embodiment, the control system 40 receivesand processes the temperature signal generated by the temperature sensor935 to maintain the operating temperature of the cooling element 915within a predetermined range of temperatures.

The size and configuration of the cooling element 915 will be determinedby the size of the article of clothing 340 as well as the size and shapeof the region within the top surface of the material of the article ofclothing 340 that will not engage the die set 320. Alternatively, thesize and configuration of the cooling element 915 will be determined bythe size of the substrate 340 as well as the size and shape of theregion within the top surface of the material of the substrate 340 thatwill not engage the die set 320.

In a particularly preferred embodiment, as illustrated in drawing FIG.9b, the platen 330 further includes supporting members 940a and 940b,rolling members 945a and 945b, guide track members 950a and 950b, andreferences stop members 955a and 955b. In the particularly preferredembodiment of the platen 330, the platen is moved into and out ofposition below and opposite to the die set 320. In this manner, loadingand unloading of substrates 340 onto and off of the platen isfacilitated by giving the operator more room to operate in. Furthermore,this particularly preferred embodiment also provides added safety byeliminating the possibility of injury to the operator caused by mistakenengagement of the die set 320 with the platen 330 during loading andunloading of substrates 340 onto and off of the platen 330.

The support members 940a and 940b support the main body of the platen330 and may comprise any number of conventional support members capableof rigid support during the molding process. The rolling members 945aand 945b support the platen 330 and permit the platen 330 to be rolledwithin and guided by the guide track members 950a and 950b. The rollingmembers 945a and 945 by may comprise any number of conventional rollingmembers capable of rigid support during the molding process. The guidetrack members 950a and 950b provide directional guidance to the platen330 during the loading and unloading process. The guide track members950a and 950b also facilitate the positioning of the platen 330 belowand opposite the die set 320. In a particularly preferred embodiment,the guide track members 950a and 950b include reference stop members955a and 955b that provide a reference point for positioning of theplaten 330 below and opposite the die set 320. The guide track members950a and 950b may comprise any number of conventional guide trackmembers capable of rigid support during the molding process.

Referring to drawing FIGS. 10a and 10b, in a preferred embodiment,during engagement of the die set 320 with the article of clothing 340,the actuator 310 moves the die set 320 toward the top surface of thearticle of clothing 340 that is supported and positioned by the heatedplaten 330. The actuator 310 continues to move the die set 320 until thedie set 320 fully engages the top surface of the article of clothing340. Upon contact of the mold 420 with the top surface of the article ofclothing 340, the resilient guide members 415 will deflect in adirection substantially parallel to the direction of movement of the dieset 320. Upon full engagement of the die set 320 with the top surface ofthe article of clothing 340, the bottom face 625 of the runner plate 410will be in intimate contact with the top face 725 of the heated mold 420with the runner plate nozzles 620 extending into the correspondingsilicone resin inlet passages 705 of the heated mold 420.

In a preferred embodiment, the movement of the die set 320 into fullengagement with the top surface of the article of clothing 340 by theactuator 310 is controlled by the control system 40 using any number ofconventional control algorithms using any number of conventionalposition sensors. In a particularly preferred embodiment, the movementof the die set 320 into full engagement is controlled by the controlsystem 40 using position sensors, pressure sensors, speed sensors,position and pressure sensors, position and speed sensors, pressure andspeed sensors, or position, pressure and speed sensors. In aparticularly preferred embodiment, the movement of the die set 320 intoengagement with the top surface of the article of clothing 340 iscontrolled by the control system 40 by monitoring at least a pressuresensor that generates a signal representative of a contact pressure ofthe die set 320 with the top surface of the article of clothing 340. Inthis manner, the article of clothing 340 will not be damaged by the dieset 320 during engagement. For typical fabric materials, the contactpressure of the die set 320 with the top surface of the article ofclothing 340 may be limited to the range, for example, of between about50 psi to 600 psi. In a preferred embodiment, for typical fabricmaterials, the contact pressure of the die set 320 with the top surfaceof the article of clothing 340 is limited to the range of between about50 psi to 300 psi. Alternatively, the preferred contact pressure willdiffer depending upon the types of substrates and thermosetting polymersemployed.

Upon full engagement of the die set 320 with the top surface of thearticle of clothing 340, the silicone resin supply or supplies 30 injecta controlled predetermined amount of silicone resin into each of themold cavities 710 of the heated mold 420. The controlled amount ofsilicone resin is received by the cooled manifold 405 and passes throughto the runner plate 410. The runner plate 410 distributes the siliconeresin via the distribution channels 610 to the corresponding moldcavities 710 of the heated mold 420. The silicone resin then fills thecorresponding mold cavities 710 of the mold 420 to form at least onethree dimensional body of silicone resin on the article of clothing 340.

Alternatively, upon full engagement of the die set 320 with the topsurface of the article of clothing 340, the silicone resin supply orsupplies 30 inject a controlled predetermined amount of a thermosettingpolymer resin into each of the mold cavities 710 of the heated mold 420.The controlled amount of thermosetting polymer resin is received by thecooled manifold 405 and passes through to the runner plate 410. Therunner plate 410 distributes the thermosetting polymer resin via thedistribution channels 610 to the corresponding mold cavities 710 of theheated mold 420. The thermosetting polymer resin then fills thecorresponding mold cavities 710 of the mold 420 to form at least onethree dimensional body of thermosetting polymer resin on the substrate340.

Alternatively, more generally, upon full engagement of the die set 320with the top surface of the article of clothing 340, the silicone resinsupplies 30 inject a controlled predetermined amount of a plurality ofdifferent types of thermosetting polymer resins into the mold cavities710 of the heated mold 420. The controlled amounts of the differenttypes of thermosetting polymer resins are received by the cooledmanifold 405 and pass through to the runner plate 410. The runner plate410 distributes the thermosetting polymer resins via the distributionchannels 610 to the corresponding mold cavities 710 of the heated mold420. The thermosetting polymer resins then fill the corresponding moldcavities 710 of the mold 420 to form a plurality of three dimensionalbodies of a plurality of types of thermosetting polymer resins on thesubstrate 340. In this manner, thermosetting polymers having similartime and temperature curing profiles may be simultaneously molded ontosubstrates.

For typical types and grades of silicone, the operating temperature ofthe cooled manifold 405 may range, for example, from about 50 to 65° F.In a preferred embodiment, for typical types and grades of silicone, theoperating temperature of the manifold 405 ranges from about 55 to 60° F.Alternatively, for different thermosetting polymers, the preferredoperating temperatures may differ.

The volumetric flow rate and pressure of the injection of silicone resininto the mold cavities 710 of the heated mold 420 is preferablycontrolled to minimize or prevent damage to the material of the articleof clothing 340. For typical clothing materials and grades of siliconeresin, the volumetric flow rate and pressure of the silicone resininjection may range, for example, from about 0.33 to 0.50 in³ /sec andabout 200 to 800 psi respectively. In a preferred embodiment, fortypical clothing materials and grades of silicone resin, the volumetricflow rate and pressure of the silicone injection ranges from about 0.01to 0.33 in³ /sec and about 300 to 600 psi respectively. Alternatively,the preferred flow rates and pressures will differ depending upon thespecific types of substrates and thermosetting polymer resins employed.

The silicone resin initially will permeate and pass through top surfaceof the material of the article of clothing 340 until it is cured on thebottom surface of the article of clothing 340 forming a skim coating. Ina preferred embodiment, the skim coating is formed within the fabric ofthe article of clothing 340. The remainder of the three dimensional bodyof silicone resin is then cured by action of the heat transferred fromthe heated mold 420 and the platen 330. The amount of time required tocure the three dimensional bodies of silicone resin will depend upon thevolume of the three dimensional bodies of silicone resin in a well knownmanner. Alternatively, the amount of time required to cure the threedimensional bodies of thermosetting polymer resins will depend upon thevolume of the three dimensional bodies of thermosetting polymer in awell known manner.

For typical types and grades of silicone, the operating temperatures ofthe mold 420 and the platen heating element 910 may range, for example,from about 75 to 500° F. and 100 to 500° F. respectively. In a preferredembodiment, for typical types and grades of silicone, the operatingtemperatures of the mold 420 and the platen heating element 910 rangefrom about 150 to 300° F. and 250 to 400° F. respectively.Alternatively, for different thermosetting polymers, the preferredoperating temperatures will differ.

The type of silicone used in the molding device 20 may comprise anynumber of commercially available silicone products such as, for example,GE LIM 3745, GE LIM 6030, GE LIM 6040, GE LIM 6045, GE LIM 6050 or GELIM 6745 available from the General Electric Company, Silicone ProductsDivision in Waterford, N.Y. In a preferred embodiment, the silicone usedis a GE LIM 6745 available from the General Electric Company, SiliconeProducts Division, in Waterford, N.Y.

More generally, any thermosetting polymer may be used in the moldingdevice 20 to form three dimensional bodies of a thermosetting polymer ona substrate. Examples of such thermosetting polymers include at leastthe following: silicone, nitrile rubber or urethane. Examples of suchsubstrates include at least the following: cloth, paper, cardboard,wood, leather, wire mesh, sponge, or foam rubber.

Once the three dimensional bodies of silicone have cured on thepositioned article of clothing 340, the die set is disengaged from thearticle of clothing 340. Upon disengagement, the mold 420 will onceagain separate from the runner plate 410 by virtue of the resilientguide members 415. The thermal isolation provided by the resilient guidemembers 415 prevents silicone resin from curing within the manifold 405and runner plate 410.

In an alternative preferred embodiment, as illustrated in drawing FIGS.11a-11c, the die set 320 of the molding device employs a thermalinsulating plate 1105 instead of the resilient guide member 415 in orderto provide thermal isolation of the runner plate 410 and manifold 405from the heated mold 420. In this alternative preferred embodiment, themanifold 405, runner plate 410, insulating plate 1105 and mold 420 arecoupled together using a conventional mechanical device such as, forexample, a set of bolts. In this manner, the insulating plate 1105prevents silicone resin within flow passages of the runner plate 410 andmanifold 405 from curing due to heat transfer from the heated mold 420.

In the alternative preferred embodiment, as illustrated in drawing FIG.11c, the runner plate 410 receives at least one supply of silicone resinfrom the manifold 405 and distributes at least one supply of siliconeresin to the insulating plate 1105. The insulating plate 1105 in turntransmits at least one supply of silicone resin to the mold 420 forsubsequent injection into at least one mold cavity 710. The insulatingplate 1105 includes at least one silicone resin flow passage 1110 thatconveys silicone from a corresponding silicone outlet passage 615 in therunner plate 410 to a corresponding silicone inlet passage 705 in themold 420.

Each silicone resin flow passage 1110 includes a silicone resin inlet1115 and a silicone resin outlet 1120. In a particularly preferredembodiment, the silicone resin inlet 1115 is adapted to receive acorresponding one of the runner plate nozzles 620.

In a particularly preferred embodiment, as illustrated in FIG. 11d, thesilicone resin outlet 1120 also includes a nozzle 1125 that is adaptedto cooperatively interact and mate with a corresponding silicone inletpassage 705 of the mold 420. In a particularly preferred embodiment, thenozzle 1125 further includes a sealing member 1130 positioned about theouter periphery of the tip of the nozzle 1125 that provides a sealbetween the nozzle 1125 and the silicone resin inlet 705 of the mold420. In a particularly preferred embodiment, the sealing member 1130comprises a Teflon coating material applied to the outer periphery ofthe nozzle 1125.

In an alternative preferred embodiment, as illustrated in drawing FIGS.11e and 11f, the die set 320 omits the runner plate 410. In this manner,a simplified configuration of the die set 320 is provided that isparticularly well suited for simple configurations of three dimensionalbodies for molding onto substrates. In the alternative preferredembodiment, the silicone resin is transmitted from the outlet passages510 of the manifold 405 directly to the inlet passages 1115 of theinsulator plate 1105. In a particularly preferred embodiment, themanifold 405 is further modified to incorporate nozzles 1135 that conveysilicone resin from the outlet passages 510 of the manifold 405 to theinlet passages 1115 of the insulator plate 1105. In the particularlypreferred embodiment, the nozzles 1135 cooperatively interact with theinlet passages 1115 of the insulator plate. In a particularly preferredembodiment, the insulator plate 1105 is further modified to incorporatenozzles that cooperatively interact with the inlet passages 705 of themold 420 substantially as illustrated in FIG. 11d.

In a particularly preferred embodiment, the nozzles 1135 of the manifold405 are further modified to thermally insulate the nozzles 1135. In onepreferred embodiment, the nozzles 1135 are fabricated from thermalinsulative materials such as, for example, beryllium copper or ceramicmaterials. In another preferred embodiment, the nozzles 1135 includethermal insulating members (not illustrated) that surround the outerperiphery of the nozzles 1135 and provide thermal insulation for thenozzles 1135. In yet another alternative embodiment, the nozzles 1135are both fabricated from thermally insulative materials and includethermal insulating members.

In an alternative preferred embodiment, as illustrated in drawing FIGS.11g, 11h and 11i, the manifold 405 of the die set 320 is divided into amanifold 1140 and a separate cold plate 1145. In this embodiment,silicone resin injected into the manifold 1140 is transmitted from themanifold 1140 to the mold 420 by passing through the cold plate 1145 andthe insulator plate 1105. The combination of the insulator plate 1105and the cold plate 1145 insulate the silicone resin within the flowpassages of the die set 320 from the heat of the mold 420 and alsomaintain the operating temperature of the silicone resin within apredetermined range of temperatures. In this manner, curing of siliconeresin within the flow passages of the die set 320 is virtuallyeliminated and optimal flow characteristics may be provided.Furthermore, this embodiment provides a simplified design that is idealfor mass production of garments and other commercial goods with threedimensional graphical designs of thermosetting polymers molded thereon.

The manifold 1140 includes at least one inlet passage 1150 and at leastone outlet passage 1155. The manifold 1140 is positioned above andcoupled to the cold plate 1145 by at least one conduit 1160. Siliconeresin injected into the inlet passage 1150 of the manifold 1140 passesthrough the outlet passage 1155 into the body of the cold plate 1145 viathe conduit 1160. The silicone resin then passes through the flowpassage 1165 of the cold plate 1145 and into the insulator plate 1105.In a preferred embodiment, the conduit 1160 and manifold 1140 areseparable from the body of the cold plate 1145. In a preferredembodiment, the cold plate further includes a nozzle 1170 thatcooperatively interacts with the inlet passage 1115 of the insulatorplate 1105. In a particularly preferred embodiment, the insulator plate1105 is further modified to incorporate nozzles that cooperativelyinteract with the inlet passages 705 of the mold 420 substantially asillustrated in FIG. 11d.

In a particularly preferred embodiment, the nozzles 1170 of the coldplate 1145 are further modified to thermally insulate the nozzles 1170.In one preferred embodiment, the nozzles 1170 are fabricated fromthermal insulative materials such as, for example, berylium copper orceramic materials. In another preferred embodiment, the nozzles 1170include thermal insulating members (not illustrated) that surround theouter periphery of the nozzles 1170 and provide thermal insulation forthe nozzles 1135. In yet another alternative embodiment, the nozzles1170 are both fabricated from thermally insulative materials and includethermal insulating members.

The cold plate 1145 is operably coupled to the water cooling device 535in a manner substantially similar to that of the manifold 405 previouslydiscussed. In this manner, the cold plate 1145 maintains the operatingtemperature of the silicone resin that passes though its flow passage1165 within a predetermined range of temperatures. In order tofacilitate heat transfer from the silicone resin to the cold plate 1145,the manifold 1140 and cold plate 1145 are preferably fabricated fromthermally conductive materials such as, for example, aluminum, brass,and steel. The operating temperature of the cold plate 1145 ismaintained within a predetermined range of operating temperatures bycooperative interaction of the cold plate 1145 with the water coolingdevice 535 in a manner substantially identical to that previouslydiscussed for the manifold 405. In this manner, the cold plate 1145maintains the temperature of the silicone resin that passes though thecold plate 1145 within a predetermined range of operating temperatures.For typical types and grades of silicone resins, the operatingtemperature of the cold plate 1145 may be maintained within the range,for example, of about 50 to 65° F. In a preferred embodiment, fortypical types and grades of silicone resins, the operating temperatureof the cold plate 1145 is maintained between about 55 to 60° F. In orderto facilitate the control of the operating temperature of the cold plate1145, a temperature sensor 1175 is preferably further provided withinthe cold plate 1145 that generates a signal representative of theoperating temperature of the cold plate 1145. In this manner, thecontrol system 40 is able to control the operating temperature of thecold plate 1145 automatically.

In a particularly preferred embodiment, as illustrated in FIG. 11i, thenozzle 1170 of the conduit 1160 cooperatively interacts with the inlet705 of the mold cavity 710 of the mold 420. In this preferredembodiment, the manifold 1140 and conduit 1160 are removably affixed tothe mold 420, the insulator plate 1105, and the cold plate 1145. In apreferred embodiment, the tip 1180 of the nozzle 1170 of the conduit1160 is further positioned substantially within the plane of the uppersurface of the mold cavity 710 in order to provide a smooth uppersurface to the molded body of silicone resin.

In a particularly preferred embodiment, the nozzles 1170 of the conduit1160 are further modified to thermally insulate the nozzles 1170. In onepreferred embodiment, the nozzles 1170 are fabricated from thermalinsulative materials such as, for example, berylium copper or ceramicmaterials. In another preferred embodiment, the nozzles 1170 includethermal insulating members (not illustrated) that surround the outerperiphery of the nozzles 1170 and provide thermal insulation for thenozzles 1135. In yet another alternative embodiment, the nozzles 1170are both fabricated from thermally insulative materials and includethermal insulating members.

Referring now to drawing FIGS. 12a-12e, an alternative preferredembodiment of the manifolds 405, 425 and 1140 will be described. In thealternative preferred embodiment, the manifolds 405, 425, and 1140further include one or more flow control valves 1205 for controllableconnecting the silicone resin flow passages of the manifolds 405, 425and 1140 to a silicone resin supply 30. In this manner, the injection ofsilicone resin into the die set 320 may be precisely controlled andstopped by action of the flow control valve 1105. This in turn willminimize or prevent the problem of silicone resin dripping whereby asmall amount of excess silicone resin is introduced into the flowpassages of the die set 320.

Alternatively, the injection of a thermosetting polymer resin into thedie set 320 may be precisely controlled and stopped by action of theflow control valve 1105. This in turn will minimize or prevent theproblem of thermosetting polymer resin dripping whereby a small amountof excess thermosetting polymer resin is introduced into the flowpassages of the die set 320.

In a preferred embodiment, as illustrated in drawing FIG. 12b, the flowcontrol valve 1205 will comprise a two-position valve, including atwo-position valve element 1210 and an actuator 1215, mounted within thebody of the manifolds 405, 425 and 1140 and controlled by the controlsystem 40. In a first position 1220, the two position valve element 1210permits flow of silicone resin from a silicone resin supply 30 to acorresponding one of the silicone resin inlet passages 505 and 1150 ofthe manifolds 405, 425 and 1140. In a second position 1225, the twoposition valve element 1210 blocks the flow of silicone resin from asilicone resin supply 30 to a corresponding one of the silicone resininlet passages 505 and 1150 of the manifolds 405, 425 and 1140. Thetwo-position flow control valve 1205 may comprise any number ofconventional two-position flow control valves. The cross-sectional areasof the various flow passages of the flow control valve 1205 arepreferably selected to prevent turbulent flow of the silicone resin, orthe particular thermosetting polymer resin, in operation.

In a particularly preferred embodiment, as illustrated in drawing FIGS.12c-12e, the two-position flow control valve 1205 comprises a rotaryflow control valve that includes a rotary valve element 1220, a fluidicslip ring 1225, and a rotary actuator 1230. The rotary valve element1220 is comprised of an annular member 1235 having an axially alignedcentral inlet flow passage 1240 and a number of radial outlet flowpassages 1245. rotation of the valve element 1220 by the rotary actuator1230 will move the radial outlet flow passages 1245 into and out ofalignment with the silicone resin outlet passages 510 and 1155 of themanifolds 405, 425 and 1140. In this manner, the flow control valve 1205provides a two position flow control valve.

In operation, the fluidic slip ring 1225 receives a supply of siliconeresin from one of the silicone supplies 30, in a well known manner, andtransmits the silicone resin to the axially aligned inlet passage 1240of the annular member 1235. Rotation of the annular member 1235 by therotary actuator 1230 then controllably moves the radial outlet passages1245 of the annular member 1235 into and out of alignment with thesilicone resin outlet passages 510 and 1155 of the manifolds 405, 425and 1140.

The annular member 1235 may comprise an annular element fabricated froma durable material such as, for example, aluminum, copper, brass, steel,ceramic, or composite materials. The axially aligned inlet passage 1240and the radial outlet passages 1245 of the annular member 1235 may beformed in the annular member 1235 using any number of conventionalfabrication processes. As illustrated in FIGS. 12d and 12e, the axiallyaligned inlet passage 1240 of the annular member 1235 preferably isclosed at a first end adjacent the rotary actuator 1230 and open at asecond end that is inserted into a corresponding one of the siliconeinlet passages 505 and 1150 of the manifolds 405, 425 and 1140. Theannular member 1235 also includes an opening (not illustrated) thatcooperatively interacts with the fluidic slip ring 1225 to permit theflow of silicone resin from the fluidic slip ring 1225 into the annularmember 1235. The cross-sectional areas of the various flow passages ofthe annular member 1235 are preferably selected to prevent turbulentflow of the silicone resin, or the particular thermosetting polymerresin, in operation.

In a preferred embodiment, as illustrated in drawing FIG. 12f, theannular member 1235 further includes O-ring, or similar, sealing members1250 positioned on an outer periphery between each of the radial flowpassages 1245. In this manner, flow out of the radial flow passages 1245are fluidicly isolated.

The fluidic slip ring 1225 is of conventional design and operation andcooperatively interacts with the annular member in a well known mannerto permit the flow of silicone resin from the silicone resin supply 30to the inlet passage 1240 of the annular member. The fluidic slip ring1225 may be mounted upon the annular member 1235 in a well known mannerusing conventional components.

The rotary actuator 1230 controllably rotates the annular member 1235 ina well known manner under the control of the control system 40. Therotary actuator 1230 may comprise any number of conventional rotaryactuators. In operation, the control system 40 preferably controls theoperation of the rotary actuator 1230 to minimize or eliminate theproblem of dripping of silicone resin.

Referring now to drawing FIG. 13a, an alternative preferred embodimentof the molding device 20 will be described. In the alternative preferredembodiment, the molding device 20 further includes at least oneselection valve 1305 and an exhaust pump 1310. The selection valve 1305controllably connects a corresponding one of the silicone inlet passages505 and 1150 of the manifolds 405, 425 and 1140 to a silicone resinsupply 30 or the exhaust pump 1310. In this manner, the injection ofsilicone resin into the die set 320 may be precisely controlled andstopped by action of the selection valve 1305. Moreover, the exhaustpump 1310 will controllably remove any excess silicone resin injectedinto the die set 320. This in turn will minimize or prevent the problemof silicone resin dripping whereby a small amount of excess siliconeresin is introduced into the flow passages of the die set 320.

Alternatively, the selection valve 1305 controllably connects acorresponding one of the silicone resin inlet passages 505 and 1150 ofthe manifolds 405, 425 and 1140 to a thermosetting polymer resin supply30 or the exhaust pump 1310. In this manner, the injection of athermosetting polymer resin into the die set 320 may be preciselycontrolled and stopped by action of the selection valve 1305. Moreover,the exhaust pump 1310 will controllably remove any excess thermosettingpolymer injected into the die set 320. This in turn will minimize orprevent the problem of thermosetting polymer resin dripping whereby asmall amount of excess thermosetting polymer resin is introduced intothe flow passages of the die set 320.

The selection valve 1305 will preferably comprise a two-position valve,including a two-position valve element 1315 and an actuator 1320,mounted within the body of the manifolds 405, 425 and 1140 andcontrolled by the control system 40. In a first position 1325, the twoposition valve element 1315 permits flow of silicone resin from asilicone resin supply 30 to a corresponding one of the silicone resininlet passages 505 and 1150 of the manifolds 405, 425 and 1140. In asecond position 1330, the two position valve element 1315 blocks theflow of silicone resin from a silicone resin supply 30 to acorresponding one of the silicone resin inlet passages 505 and 1150 ofthe manifolds 405, 425 and 1140 and instead connects the silicone inletpassages 505 and 1150 of the manifolds 405, 425 and 1140 to the inlet ofthe exhaust pump 1310. The selection valve 1305 may comprise any numberof conventional selection valves. The cross-section areas of the variousflow passages of the selection valve 1305 are preferably selected tominimize or prevent turbulent flow of the silicone. Alternatively, thedesired and preferred dimensions of the flow passages will vary as afunction of the particular thermosetting polymer selected for use.

In a particularly preferred embodiment, the selection valve 1305 is amodel no. 2F-B2X32-V-B-31VA selection valve, available fromParker-Hannifin in Elyria, Ohio, mounted external to the body of themanifolds 405, 425 and 1140.

The exhaust pump 1310 may comprise any number of conventional hydraulicpumps. In operation, the control system 40 preferably controls theoperation of the selection valve 1305 and the exhaust pump 1310 tominimize or prevent the problem of dripping of silicone resin.

Referring now to drawing FIGS. 13b-13c, an alternative preferredembodiment of the molding device 20 will be described. In thealternative preferred embodiment, the molding device 20 further includesat least one flow control valve 1335 and a vacuum source 1340 and themanifolds 405, 425 and 1140 further includes at least one exhaustpassage 1345 that connects a corresponding one of the silicone resininlet passages 505 and 1150 to the flow control valve 1335. Inoperation, the flow control valve 1335 controllably connects acorresponding one of the silicone inlet passages 505 and 1150 of themanifolds 405, 425 and 1140 to the vacuum source 1340. In this manner,the injection of silicone resin into the die set 320 may be preciselycontrolled and stopped by action of the flow control valve 1335.Moreover, the vacuum source 1340 will controllably remove any excesssilicone resin injected into the die set 320. This in turn will minimizeor prevent the problem of silicone resin dripping whereby a small amountof excess silicone resin is introduced into the flow passages of the dieset 320.

Alternatively, the flow control valve 1335 controllably connects acorresponding one of the silicone inlet passages 505 and 1150 of themanifolds 405, 425 and 1140 to the vacuum source 1340. In this manner,the injection of a thermosetting polymer resin into the die set 320 maybe precisely controlled and stopped by action of the flow control valve1335. Moreover, the vacuum source 1340 will controllably remove anyexcess thermosetting polymer resin injected into the die set 320. Thisin turn will minimize or prevent the problem of thermosetting polymerresin dripping whereby a small amount of excess thermosetting polymerresin is introduced into the flow passages of the die set 320.

The flow control valve 1335 will preferably comprise a two-positionvalve, including a two-position valve element 1350 and an actuator 1355,mounted within the body of the manifolds 405, 425 and 1140 andcontrolled by the control system 40. In a first position 1360, the twoposition valve element decouples the vacuum source 1340 from acorresponding one of the silicone exhaust passages 1345 of the manifolds405, 425 and 1140. In a second position 1365, the two position valveelement 1350 couples the vacuum source 1340 to a corresponding one ofthe silicone exhaust passages 1345 of the manifolds 405, 425 and 1140.The flow control valve 1335 may comprise any number of conventionalselection valves. The cross-section areas of the various flow passagesof the flow control valve 1335 and exhaust passages 1345 are preferablyselected to minimize or prevent turbulent flow of the silicone resin.Alternatively, the desired and preferred dimensions of the flow passageswill vary as a function of the particular thermosetting polymer selectedfor use.

The exhaust passage 1345 may be provided within the body of themanifolds 405, 425 and 1140 using any number of conventional fabricationprocesses. In a preferred embodiment, the cross-sectional area of theexhaust passage 1345 is selected to minimize or prevent turbulent flow.

The vacuum source 1340 may comprise any number of vacuum sources suchas, for example, the inlet to a hydraulic pump or an evacuated chamber.In operation, the control system 40 preferably controls the operation ofthe flow control valve 1335 and the vacuum source 1340 to minimize orprevent the problem of dripping of silicone resin.

Referring now to drawing FIG. 13d, an alternative preferred embodimentof the molding device 20 illustrated in drawing FIG. 13a will bedescribed. In the alternative preferred embodiment, the exhaust pump1310 is replaced with a connection to ambient atmospheric pressure. Inthis manner, the injection of silicone resin into the die set 320 may beprecisely controlled and stopped by action of the selection valve 1305.Moreover, the ambient atmospheric pressure, which is lower than typicalinjection pressures, will effectively remove any excess silicone resininjected into the die set 320. This in turn will minimize or prevent theproblem of silicone resin dripping whereby a small amount of excesssilicone resin is introduced into the flow passages of the die set 320.

Referring now to drawing FIGS. 14a and 14b, an alternative preferredembodiment of the molding device 20 will be described that minimizes theimpact of silicone resin dripping. In the alternative preferredembodiment, silicone resin drips 1405 that remain within the flowpassages of the die set 320 are blown out into the mold cavities 710 ofthe mold 420 by a blast of compressed air or short burst of highpressure silicone. The silicone resin drips 1405 are then molded intothe three dimensional body of silicone resin within the mold cavity 710during a normal molding cycle. In this manner, regardless of whether thesilicone resin drip 1405 is cured or uncured within the die set, thesilicone resin drip is completely removed and molded into the threedimensional body.

Alternatively, thermosetting polymer resin drips 1405 that remain withinthe flow passages of the die set 320 are blown out into the moldcavities 710 of the mold 420 by a blast of compressed air or short burstof high pressure thermosetting polymer. The thermosetting polymer resindrips 1405 are then molded into the three dimensional body ofthermosetting polymer resin within the mold cavity 710 during a normalmolding cycle. In this manner, regardless of whether the thermosettingpolymer resin drip 1405 is cured or uncured within the die set, thethermosetting polymer resin drip is completely removed and molded intothe three dimensional body.

Referring now to drawing FIGS. 15-20b, a preferred embodiment of theplurality of silicone resin supplies 30 will be described. The pluralityof silicone resin supplies 30 preferably controllably provide apredetermined amount a plurality of supplies of silicone resin to eachof the molding devices 20. In this manner, each of the molding devices20 can mold a plurality of three dimensional bodies onto substratessubstantially simultaneously. Furthermore, the plurality of supplies ofsilicone resin 30 preferably provide at least a plurality of colors ofsilicone resin. In this manner, each molding device can mold a pluralityof three dimensional silicone bodies having a plurality of colors onto asubstrate.

Alternatively, and more generally, a plurality of thermosetting polymersupplies 30 preferably controllably provide a predetermined amount aplurality of supplies of thermosetting polymer resins to each of themolding devices 20. In this manner, each of the molding devices 20 canmold a plurality of three dimensional bodies of thermosetting polymersonto substrates substantially simultaneously. Furthermore, the pluralityof supplies of thermosetting polymer resins preferably provide at leasta plurality of colors of thermosetting polymer resins. In this manner,each molding device can mold a plurality of three dimensionalthermosetting polymer bodies having a plurality of colors onto asubstrate.

As illustrated in drawing FIG. 16, in a preferred embodiment, thesilicone resin supplies 30 include a source of a material A 1605, asource of a material B 1610, a pump A 1615, a pump B 1620, a flowcontrol assembly A 1625, a flow control assembly B 1630, a distributionchamber A 1635, a distribution chamber B 1640, a color block 1645, andan injector 1650. In operation, the pump A 1615 pumps material A fromthe source of material A 1605 to the flow control assembly A 1625. Theflow control assembly A 1625 is adapted to control the pressure and flowrate of the material A. The material A is then distributed in adistribution chamber A 1635 to at least one color block 1645. In aparticularly preferred embodiment, the distribution chamber Adistributes material A to a plurality of color blocks as indicated bythe arrows.

In an alternative preferred embodiment, the color block 1645 is replacedwith a conventional mixing device such as, for example, a static mixerthat mixes the materials A and B to generate an uncolored thermosettingpolymer for subsequent injection into a molding device 20.

Likewise, the pump B 1620 pumps material B from the source of material B1610 to the flow control assembly B 1630. The flow control assembly B1630 is adapted to control the pressure and flow rate of the material B.The material B is then distributed in a distribution chamber B 1640 toat least one color block 1645. In a particularly preferred embodiment,the distribution chamber B 1640 distributes material B to a plurality ofcolor blocks as indicated by the arrows.

The at least one color block 1645 receives material A, receives materialB, controllably injects a pigment and mixes materials A and B and thepigment to form a colored silicone resin. Alternatively, and moregenerally, a colored thermosetting polymer resin may be formed by usingthe appropriate materials A and B, and possibly C, D, E, etc., dependingupon the particular thermosetting polymer selected. The colored siliconeresin, or thermosetting polymer resin, is then received by at least oneinjector 1650 for subsequent injection into the manifolds 405, 425 and1140 of at least one molding device 20. In an alternative preferredembodiment, the color block 1645 is modified to remove the capability toinject pigment and thereby generates an uncolored thermosetting polymerresin.

In the preferred embodiment, all of the silicone resin supplies sharethe supply of material A 1605, the supply of material B 1610, the pump A1615, the pump B 1620, the flow control assembly A 1625, the flowcontrol assembly B 1630, the distribution chamber A 1635 and thedistribution chamber B 1640.

The materials A and B may comprise any number of conventionalconstituent materials for conventional silicones such as, for example,GE LIM 3745, GE LIM 6030, GE LIM 6045, GE LIM 6050 and GE LIM 6745,available from General Electric, Silicone Products Division, inWaterford, N.Y. In a preferred embodiment, the materials A and Bcomprise conventional constituent materials for silicones identified asGE LIM 3745 and GE LIM 6745, available from General Electric, SiliconeProducts Division, in Waterford, N.Y. More generally, any thermosettingpolymer resin that requires the mixture of two or more materials may beutilized by the appropriate addition, as necessary, of additionalsupplies, pumps, flow control assemblies and distribution chambers. Inthis manner, the plurality of silicone resin supplies 30 may be adaptedfor use with virtually any thermosetting polymer. Examples of suchthermosetting polymers include at least silicone, nitrile rubber orurethane.

The pumps A and B, 1615 and 1620, may comprise any number ofconventional hydraulic pumps capable of pumping typical types and gradesof silicone resin constituent materials. The pumps A and B, 1615 and1620, furthermore may comprise constant or variable displacement pumps.In a preferred embodiment, the pumps A and B, 1615 and 1620, are modelno. STSKWNSSMH #100 pumps available from St. Services. The pumps A andB, 1615 and 1620, may pump materials A and B at flow rates ranging, forexample, from about 0.1 gal/min. to 100 gal./min. In a preferredembodiment, the pumps A and B pump the materials A and B at flow ratesranging from about 1.0 to 10.0 gal./min. Alternatively, more generally,the desired flow rates will vary as a function of particularthermosetting polymer selected and the constituent materials comprisingthe specific thermosetting polymer selected.

The flow control assemblies A and B, 1625 and 1630, control theoperating pressure and flow rate of materials A and B. In a preferredembodiment, as illustrated in drawing FIG. 17a, the flow controlassemblies A and B, 1625 and 1630, each include an accumulator 1705, apressure sensor 1710, a flowmeter 1715, a variable orifice 1720, apressure relief valve 1725 and a drainage valve 1730.

In operation, material pumped into the flow control assembly is receivedby the accumulator 1705. The accumulator 1705 operates in a well knownmanner to maintain a controlled reservoir of material at a predeterminedrange of operating pressures. The operating pressure of the material ismonitored by the pressure sensor 1710 which generates, in a well knownmanner, a signal representative of an operating temperature of thematerial within the flow control assembly for processing by the controlsystem 40. The flowmeter 1715 monitors the flow rate of material withinthe flow control assembly and generates, in a well known manner, asignal representative of a flow rate of the material for processing bythe control system 40. The variable orifice 1720 controls the flow rateof material exhausting from the flow control assembly under the controlof the control system 40. The pressure relief valve 1725 automaticallyreleases material from the flow control assembly whenever the operatingpressure exceeds a predetermined maximum as determined by a spring biasprovided in the pressure relief valve 1725. The exhaust valve 1730controllably permit material to be exhausted from the flow controlassembly under the control of the control system 40. The control system40 monitors the pressure sensor 1710 and flow sensor 1715 andcontrollably operates the variable orifice 1720 and exhaust valve 1730to maintain the operating pressure and flow rate of the flow controlassembly within a predetermined range of values using conventionalcontrol algorithms for fluids.

For typical silicone constituent materials, the flow control assemblies1625 and 1630 may maintain the operating pressure of the materialswithin the flow control assemblies 1625 and 1630, for example, betweenabout 10 and 1000 psi. In a preferred embodiment, for typical siliconeconstituent materials, the flow control assemblies 1625 and 1630maintain the operating pressure of the materials within the flow controlassemblies between about 100 and 250 psi. For typical siliconeconstituent materials, the flow control assembly may maintain the flowrate of the materials within the flow control assemblies 1625 and 1630,for example, between about 0.1 gal./min. to 100 gal./min during aninjection cycle. In a preferred embodiment, for typical siliconeconstituent materials, the flow control assemblies 1625 and 1630maintain the flow rate of the materials within the flow controlassemblies 1625 and 1630 between about 1 and 10 gal./min. during aninjection cycle. Alternatively, more generally, the desired operatingparameters of the flow control assemblies 1625 and 1630 will depend uponthe particular thermosetting polymer selected and the specificconstituent components of that thermo-setting polymer.

In a particularly preferred embodiment, the flow control assemblies 1625and 1630 are available from Mitten Fluid Power in Syracuse, N.Y.

In an alternative preferred embodiment, as illustrated in drawing FIG.17b, the flow control assemblies 1625 and 1630 are conventionalcommercially available fluid conduits. In a particularly preferredembodiment, the flow control assemblies 1625 and 1630 are available fromMitten Fluid Power in Syracuse, N.Y.

The distribution chambers A and B, 1625 and 1630, distribute the A and Bmaterials to at least one color block 1645. As illustrated in drawingFIG. 18a, the distribution chambers include a chamber 1805 having asingle inlet 1810 and at least one outlet 1820. In a preferredembodiment, the chamber 1805 includes a plurality of outlets 1820 thatare in turn each connected to a color block as indicated by the arrows.The volumetric size of the chamber 1805 may range, for example, fromabout 0.125 to 100 gallons. In a preferred embodiment, for typical typesand grades of silicone, the volumetric size of the chamber 1805 is about10 gallons. Alternatively, more generally, the desired volumetric sizeof the chamber 1805 will vary as a function of the particularthermosetting polymer selected as well as the size and number of moldingdevices 20 and mold cavities 710 simultaneously in use.

In a particularly preferred embodiment, the distribution chambers aremodel no. UT 102 distribution chambers available from Mitten Fluid Powerin Syracuse, N.Y.

The color block 1645 receives materials A and B from the distributionchambers A and B, 1635 and 1640, controllably adds a pigment, and mixesmaterials A and B with the pigment in a well known manner to form acolored silicone resin. As illustrated in drawing FIG. 19a, in apreferred embodiment, the color blocks include a material A inlet 1905,a material B inlet 1910, a pigment supply 1915, a chamber 1920, a staticmixer 1925, and a colored silicone resin outlet 1930. The A and Bmaterials are received in the inlets 1905 and 1910 and input to thechamber 1920. A pigment is injected into the chamber by the pigmentsupply 1915 under the control of the control system 40. The mixture ofmaterials A and B and the pigment are then mixed in a well known mannerwithin the static mixer 1925. The resulting colored silicone resin isthen output through the colored silicone outlet 1930. In an alternativepreferred embodiment, the pigment supply 1915 is omitted from the colorblock 1645 and only uncolored polymer resin is produced.

The color block 1645 may comprise any number of conventionalcommercially available color blocks. In a preferred embodiment, thecolor block is a model no. SSMH111 available from St. Services inAlbany, N.Y.

Alternatively, the color block 1645 may be adapted to mix and color anynumber of thermosetting polymer resins such as, for example, silicone,nitrile rubber or urethane. In another alternative preferred embodiment,the color block 1645 is modified to omit the pigment supply 1915.

As illustrated in FIG. 19a, in a particularly preferred embodiment, aflow control valve 1935 is further provided between the colored siliconeresin outlet 1930 and the injector 1650 that controllably couples aninjector 1650 to the color block 1645. The flow control valve 1935 maycomprise any number of conventional flow control valve. In a preferredembodiment, the flow control valve 1935 is a model FM2DDKN flow controlvalve available from Parker-Hannifin located in Elyria, Ohio.

The injectors 1650 controllably inject a controlled amount of the supplyof silicone resin provided by the color block 1645 into one or moremanifolds 405a-405c, 425a-425c, or 1140a-1140c of one or morecorresponding molding devices 20a-20c. As illustrated in drawing FIGS.20a and 20b, in a preferred embodiment, each of the injectors 1650comprise a silicone resin inlet 2005, a silicone resin distributionjunction 2010, one or more check valves 2015a-2015c, one or moresilicone resin feed lines 2020a-2020c, one or more silicone resin feedjunctions 2025a-2025c, one or more silicone resin injection chambers2030a-2030c, one or more injection pistons 2035a-2035c, one or moreinjection housings 2040a-2040c, one or more actuator rods 2045a-2045c,an actuator 2050, one or more position sensors 2055a-2055b, one or moresilicone resin injection lines 2060a-2060c, and one or more flow controlvalves 2065a-2065c. Alternatively, the injectors 1650 may controllablyinject a controlled amount of a supply of thermosetting polymer resininto one or more manifolds 405a-405c, 425a-425c or 1140a-1140c of one ormore corresponding molding devices 20a-20c.

During operation of the injector 1650, silicone resin is either drawninto or pumped out of the silicone resin injection chambers 2030a-2030cby controlled movement of the injection pistons 2035a-2035c, in adirection indicated by the downward arrow 2070, during a silicone resinloading cycle, or in a direction indicated by the upward arrow 2075,during a silicone resin injection cycle. During the silicone resinloading cycle of the injector 1650, the supply of colored silicone resinfrom the color block 1645 is drawn into one or more silicone resininjection chambers 2030a-2030c through the silicone resin inlet 2005,silicone resin distribution junction 2010, one or more check valves2015a-2015c, one or more silicone resin feed lines 2020a-2020c, one ormore silicone resin feed junctions 2025a-2025c, and a portion of the oneor more silicone resin injection lines 2060a-2060c. During the siliconeresin injection cycle, a controlled amount of silicone resin is pumpedout of one or more silicone resin injection chambers 2030a-2030c to oneor more manifolds 405a-405c, 425a-425c, or 1140a-1140c of one or morecorresponding molding devices 20a-20c through one or more silicone resininjection lines 2060a-2060c and one or more flow control valve2065a-2065c.

The silicone resin inlet 2005 is fluidicly coupled to the outlet of theflow control valve 1935 and the inlet of the silicone resin distributionjunction 2010. The silicone resin inlet 2005 conveys silicone, or otherthermosetting polymer resin, from the outlet of the flow control valve1935 to the inlet of the silicone resin distribution junction 2010. Thesilicone resin inlet 2005 may comprise any number of conventional fluidconduits adapted to convey conventional thermosetting polymer materialssuch as, for example, silicone. The cross-sectional area of the fluidpathway of the silicone resin inlet 2005 will vary is a known manner asa function of the particular operating conditions. In a preferredembodiment, the silicone resin inlet 2005 is a model UT 201 availablefrom St. Services in Albany, N.Y.

The silicone resin distribution junction 2010 is fluidicly coupled tothe outlet of the silicone resin inlet 2005 and to the inlets of one ormore corresponding silicone resin feed lines 2020a-2020c. The siliconeresin distribution junction 2010 conveys and distributes silicone, orsome other thermosetting polymer resin, from the silicone resin inlet2005 to the inlet of one or more corresponding silicone resin feed lines2020a-2020c. The silicone resin distribution junction 2010 may compriseany number of conventional fluidic junctions adapted to conveythermosetting polymer resins such as, for example, silicone resins. Thecross-sectional area of the fluid pathways of the silicone resindistribution junction 2010 will vary in a known manner as a function ofthe particular operating conditions. In a preferred embodiment, thesilicone resin distribution junction 2010 is a model UT 202 junctionavailable from St. Services in Albany, N.Y.

The one or more silicone resin feed lines 2020a-2020c are fluidiclycoupled to the corresponding outlets of the silicone resin distributionjunction 2010 and to the corresponding inlets of one or more siliconeresin feed junctions 2025a-2025c. The one or more silicone resin feedlines 2020a-2020c convey silicone resin, or some other thermosettingpolymer resin, from the silicone resin distribution junction 2010 to thecorresponding inlets of one or more silicone resin feed junctions2025a-2025c. The one or more silicone resin feed lines 2020a-2020c maycomprise any number of conventional fluidic conduits adapted to conveythermosetting polymer resins such as, for example, silicone resins. Thecross-sectional area of the fluid pathways of the silicone resin feedlines 2020a-2020c will vary in a known manner as a function of theparticular operating conditions. In a preferred embodiment, the siliconeresin feed lines 2020a-2020c are a model UT 203 feed line available fromSt. Services in Albany, N.Y.

In a particularly preferred embodiment, each of the silicone resin feedlines 2020a-2020c include corresponding check valves 2015a-2015c. Thecheck valves 2015a-2015c permit fluid flow in forward directionindicated by the arrows but prevent fluid flow in the reverse direction.In this manner, during the silicone resin loading cycle, the one or morecheck valves 2015a-2015c permit silicone resin, or some otherthermosetting polymer resin, to flow into the silicone resin injectionchambers 2030a-2030c from the silicone resin inlet 2005. While duringthe silicone resin injection cycle, the one or more check valves2015a-2015c block the reverse flow of silicone resin, or some otherthermosetting polymer resin, pumped out of the silicone resin injectionchambers 2030a-2030c. The check valves 2015a-2015c may comprise anynumber of conventional fluid check valves. In a preferred embodiment,the check valves 2015a-2015c are model CV041P-65 check valves, availablefrom Parker-Hannifin in Elyria, Ohio.

The one or more silicone resin feed junctions 2025a-2025c are fluidiclycoupled to the outlet of one or more silicone resin feed lines2020a-2020c and to the inlet of one or more silicone resin injectionlines 2060a-2060c. The one or more silicone resin feed junctions2025a-2025c convey silicone resin, or some other thermosetting polymerresin, from the outlet of one or more silicone resin feed lines2020a-2020c to the inlets of one or more corresponding silicone resininjection lines 2060a-2060c. The one or more silicone resin feedjunctions 2025a-2025c may comprise any number of conventional fluidicconduits adapted to convey thermosetting polymer resins such as, forexample, silicone resins. The cross-sectional area of the fluid pathwaysof the silicone resin feed junctions 2025a-2025c will vary in a knownmanner as a function of the particular operating conditions. In apreferred embodiment, the silicone resin feed junctions 2025a-2025c aremodel UT 301 feed junctions available from St. Services in Albany, N.Y.

The one or more silicone resin injection lines 2060a-2060c are fluidiclycoupled to the outlet of one or more corresponding silicone resininjection chambers 2030a-2030c, the outlet of one or more correspondingsilicone resin feed junctions 2025a-2025c, one or more correspondingflow control valves 2065a-2065c, and the inlets of one or more die setmanifolds 405a-405c, 425a-425c, or 1140a-1140c of one or morecorresponding molding devices 20a-20c. During the silicone resin loadingcycle, the one or more silicone resin injection lines 2060a-2060c conveysilicone resin from the outlets of one or more corresponding siliconeresin feed junctions 2025a-2025c to the corresponding inlet of one ormore corresponding silicone resin injection chambers 2030a-2030c. Duringthe silicone resin injection cycle, the one or more silicone resininjection lines 2060a-2060c convey silicone resin from the correspondingoutlets of one or more silicone resin injection chambers 2030a-2030c tothe corresponding inlets of one or more die set manifolds 405a-405c,425a-425c, or 1140a-1140c of one or more corresponding molding devices20a-20c.

The one or more silicone resin injection lines 2060a-2060c may compriseany number of conventional fluidic conduits adapted to conveythermosetting polymer resins such as, for example, silicone resins. Thecross-sectional area of the fluid pathways of the silicone resininjection lines 2060a-2060c will vary in a known manner as a function ofthe particular operating conditions. In a preferred embodiment, thesilicone resin injection lines 2060a-2060c are model UT-208 injectionlines available from St. Services in Albany, N.Y.

In a particularly preferred embodiment, as illustrated in drawing FIG.20a, each of the silicone resin injection lines 2060a-2060c furtherinclude corresponding flow control valves 2065a-2065c. The flow controlvalves 2065a-2065c controllably fluidicly couple or decouple thesilicone resin injection lines 2060a-2060c to the corresponding inletsof the one or more die set manifolds 405a-405c, 425a-425c or 1140a-1140cof one or more molding devices 20a-20c. The flow control valves2065a-2065c may comprise any number of conventional flow control valves.In a preferred embodiment, the flow control valves 2065a-2065c are modelFM2DDKN flow control valves, available from Parker-Hannifin in Elyria,Ohio. In a particularly preferred embodiment, the operation of the flowcontrol valves 2065a-2065c is controlled by the control system 40.

The at least one silicone resin injection chambers 2030a-2030c aredefined by the combination and cooperative interaction of one or moresilicone injection pistons 2035a-2035c with corresponding one or moresilicone resin injection housings 2040a-2040c. The silicone resininjection pistons 2035a-2035c controllably reciprocate within theinterior of corresponding one or more silicone resin injection housings2040a-2040c to draw silicone resin in or pump silicone resin out of thecorresponding one or more silicone resin injection housings 2040a-2040c.

As illustrated in drawing FIG. 20b, the one or more silicone resininjection housings 2040a-2040c preferably comprise a cylindricallyshaped annular member including a circular sealing member at one endhaving a fluid passage adapted for coupling with a corresponding one ofthe silicone resin injection lines 2060a-2060c. In a particularlypreferred embodiment, the one or more silicone resin injection housings2040a-2040c are metallic cylindrically shaped annular members having acircular sealing member on one end that further includes a fluid passagecoupled to a corresponding one of the silicone resin injection lines2060a-2060c.

The silicone resin injection pistons 2035a-2035c are preferably selectedto slidingly and sealingly interact with the inner surfaces of theannular members of the silicone resin injection housings 2040a-2040c. Ina particularly preferred embodiment, the silicone resin injectionpistons 2035a-2035c are fabricated from durable materials such as, forexample, aluminum and include circumferential sealing members2070a-2070c for engaging the inner surface of the annular member of thecorresponding silicone resin injection housing 2040a-2040c. The siliconeresin injection pistons 2035a-2035c are reciprocated within thecorresponding silicone resin injection housings 2040a-2040c bycorresponding silicone resin injection actuator rods 2045a-2045c. Thesilicone resin actuator drive rods 2045a-2045c are in turn coupled tothe actuator 2050.

In a particularly preferred embodiment, as illustrated in drawing FIG.20a, the one or more silicone resin injection pistons 2035a-2035c arecommonly actuated by the actuator 2050. In this manner, a plurality ofthree dimensional bodies of silicone resin, or some other thermosettingpolymer resin, may be controllably formed substantially simultaneouslyonto a plurality of substrates.

The actuator 2050 controllably actuates one or more silicone resininjection pistons 2035a-2035c under the control of the control system40. The actuator 2050 may comprise any number of conventional actuators.In a preferred embodiment, the actuator 2050 is a model2.50KS21HLT38-38AX4.200 actuator, available from Parker-Hannifin inElyria, Ohio. In a particularly preferred embodiment, as illustrated indrawing FIG. 20a, the actuator 2050 further includes at least oneposition sensor 2055a-2055b to provide at least one signalrepresentative of the position of the actuator and/or the one or moreactuator drive rods 2045a-2045c. In this manner, the control system 40may provide precise control of the position of the silicone resininjection pistons 2035a-2035c and thereby inject a controlled andprecise amount of silicone resin into the die set manifolds 405a-405c,425a-425c or 1140a-1140c of one or more molding devices 20a-20c. In aparticularly preferred embodiment, as illustrated in drawing FIG. 20a,one or more of the one or more die set manifolds 405a-405c, 425a-425c or1140a-1140c of the one or more corresponding molding devices 20a-20calso receive supplies of silicone resin from other injectors asindicated by the arrows. In this manner, each of the molding devices 20can controllably mold a plurality of three dimensional bodies ofmultiple colors of silicone resin, or some other thermosetting polymerresin, onto a plurality of substrates substantially simultaneously.

The control system 40 monitors and controls the operation of theapparatus 10 and may include one more sensors and actuating devices. Asillustrated in drawing FIG. 21, in a preferred embodiment, the controlsystem 40 includes a programmable general purpose computer orprogrammable controller 2105, a keyboard 2110, a display 2115, a modem2120, a local-area-network communication device 2125, awide-area-network communication device 2130, the silicone resin pumps1615 and 1620, the water cooling devices, 535 and 930, for each of themolding devices 20, the heaters, 715 and 910, for each of the moldingdevices 20, the valve actuators, including at least 1215, 1230, 1320 and1355, for the molding devices 20 and silicone resin supplies 30, thepressure sensors 1710 for the silicone resin supplies 30, thetemperature sensors, 520, 720 and 925, for each of the molding devices20, the actuators 310 for each of the molding devices 20, the actuators2050 for each of the silicone resin injectors, the flow sensors 1715 forthe silicone resin supplies 30, 2135 palm switches for the apparatus 10,and light curtains 2140 for each of the molding devices 20.

The programmable controller 2105 monitors and controls the operation ofthe apparatus 10. The programmable controller 2105 may comprise anynumber of conventional programmable industrial controllers capable oftransmitting and receiving analog and digital signals. The programmablecontroller 2105 may communicate with the various input-output devices ofthe apparatus 10 using any number of conventional communicationprotocols. In a preferred embodiment, the programmable controller 2105is a model FXON programmable controller, commercially available from theMitsubishi Corporation.

Alternatively, hard-wired and/or manual control may be substituted forthe programmable controller 2105. Alternatively, any combination ofprogrammable control, hard-wired control, and manual operator controlmay be used.

The programmable controller 2105 preferably includes a conventionaloperator interface such as a keyboard 2110 and display 2115.

The programmable controller 2105 preferably includes a modem 2120 thatpermits communication between the programmable controller 2105 and otherremote devices. The modem 2105 may comprise any number of conventionalmodems.

The control system 40 preferably includes a LAN 2125 and a LAN 2130 toenable communication with a number of remote devices in a conventionalnetwork environment. In this manner, a number of apparatus 10 may beemployed to fabricate garments or other substrates with threedimensional moldings of silicone or other thermosetting polymers at aplurality of geographic locations with remote control and monitoring ofthe plurality of apparatus 10 using the LAN 2125 and/or WAN 2130. TheLAN 2125 and WAN 2130 may comprise any number of conventional devicesand communication protocols.

The control system 40 preferably includes a number of conventionaloperator safety devices including palm switches 2135 and light curtains2140. The palm switches 2135 are of conventional design and operationand protect the operator from physical injury by requiring the operatorto press both palm switches during engagement of the die sets of themolding devices 20. The light curtains 2140 are of conventional designand construction and surround the molding devices 20 with a lightbarrier that, if broken, shuts down the molding devices 20 to protectthe operator from injury.

Referring now to drawing FIGS. 22a-22b, a preferred embodiment of theoperation of the molding device 20 will be described. During initialstartup 2205, the physical set-up of the molding device 20 is prepared.This will typically include preparing and calibrating the actuator 310for the molding device 20, selecting, preparing and calibrating the dieset 320 for the molding device 20, selecting, preparing and calibratingthe alignment and position of the platen 330 for the molding device 20,selecting, preparing and calibrating the silicone resin, or otherthermosetting polymer resin, supplies 30 for the molding device 20, andinitializing and calibrating the control system 40.

After initial startup 2205 has been completed, the operator willinitiate manifold or cold plate cooling 2210. The initiation of manifoldor cold plate cooling 2210 will preferably include the steps ofselecting a predetermined range of operating temperatures for themanifolds 405 and 425 or cold plate 1145. For typical types and gradesof silicone resins, the operating temperature range of the manifolds 405and 425 or cold plate 1145 may range, for example, from about 50 to 65°F. In a preferred embodiment, the operating temperature range of themanifolds 405 and 425 or cold plate 1145 ranges from about 55 to 60° F.The preferred operating temperature range of the manifolds 405 and 425or cold plate 1145 will vary as a function of the volume and particulartype and grade of thermosetting polymer selected for use with themolding device 20.

After initiate manifold or cold plate cooling 2210 has been completed,the operator will initiate mold or hot plate heating 2215. Theinitiation of mold or hot plate heating 2215 will preferably include thesteps of selecting a predetermined range of operating temperatures forthe mold 420 and/or hot plate 760. For typical types and grades ofsilicone resins, the operating temperature range of the mold 420 and/orhot plate 760 may range, for example, from about 75 to 500° F. In apreferred embodiment, the operating temperature range of the mold 420and/or hot plate 760 ranges from about 150 to 300° F. The preferredoperating temperature range of the mold 420 will vary as a function ofthe number and volume of mold cavities 701, and the particular type andgrade of thermosetting polymer resin selected for use with the moldingdevice 20.

The order of execution of the operational steps of initiate manifold orcold plate cooling 2210 and initiate mold or hot plate heating 2215 maybe reversed. In a particularly preferred embodiment, however, theoperational steps of initiate manifold or cold plate cooling 2210 andinitiate mold or hot plate heating 2215 are performed substantially inthe order described above in order to prevent the operating temperatureof the manifold 405 from rising too high due to heat transfer from themold 420. In this manner, the possibility of the curing of siliconeresin, or some other thermosetting polymer resin, within the manifoldduring initial operation of the molding device 20 is minimized orprevented.

After initiate mold or hot plate heating 2215 has been completed, theoperator will initiate platen cooling 2220. The initiation of platencooling 2220 will preferably include the steps of selecting apredetermined range of operating temperatures for the cooled region ofthe platen 330. For typical types and grades of substrates, theoperating temperature range of the cooled region of the platen 330 mayrange, for example, from about 45 to 70° F. In a preferred embodiment,the operating temperature range of the cooled region of the platen 330ranges from about 55 to 60° F. The preferred operating temperature rangeof the cooled region of the platen 330 will vary as a function of thetype and thickness of the substrate, and the operating temperatures ofthe heated region of the platen 330 and of the mold 420.

After initiate platen cooling 2220 has been completed, the operator willinitiate platen heating 2225. The initiation of platen heating 2225 willpreferably include the steps of selecting a predetermined range ofoperating temperatures for the heated region of the platen 330 thatengages the die set 320. For typical types and grades of siliconeresins, the operating temperature range of the heated region of theplaten 330 may range, for example, from about 100 to 500° F. In apreferred embodiment, the operating temperature range of the heatedregion of the platen 330 ranges from about 250 to 400° F. The preferredoperating temperature range of the heated region of the platen 330 willvary as a function of the type and thickness of the substrate, the typeand grade of thermosetting polymer resin selected, and the operatingtemperature of the mold 420.

The order of execution of the operational steps of initiate platencooling 2220 and initiate platen heating 2225 may be reversed. In aparticularly preferred embodiment, however, the operational steps ofinitiate platen cooling 2220 and initiate platen heating 2225 areperformed substantially in the order described above in order to preventthe operating temperature of the cooled region of the platen 330 fromrising too high due to heat transfer from the heated region of theplaten 330. In this manner, the possibility of damage to the substratedue to excessive temperature and heat during initial operation of themolding device 20 is minimized or prevented.

After initiate platen heating 2225 has been completed, the operator willselect the contact pressure of the die set 320 onto the substrate 340during engagement of the die set 320 with the substrate 340. Theselection of contact pressure of the die set 2230 will preferablyinclude the steps of selecting a predetermined range of permissiblecontact pressures of the die set 320 with the substrate 340 duringengagement. For typical types and grades of clothing, the contactpressure of the die set 320 with the clothing 340 during engagement mayrange, for example, from about 50 to 600 psi. In a preferred embodiment,the contact pressure of the die set 320 with the clothing 340 rangesfrom about 50 to 300 psi. The preferred range of contact pressurebetween the die set 320 and the substrate 340 during engagement vary asa function of the type and thickness of the substrate.

After selection of the contact pressure 2230 has been completed, theoperator will select the quantity of silicone resin, or otherthermosetting polymer resin, for injection into each of the moldcavities 710 of the mold 420. The selection of the quantity of siliconeresin for injection into each of the mold cavities 710 of the mold 420in step 2235 will preferably include the step of selecting a separatequantity for each mold cavity 710 of the mold 420. In this manner, aplurality of supplies of silicone resin may be controllably injectedinto the mold cavities 710 of the mold 420 from a plurality of suppliesof silicone resin 30. For typical types of clothing and threedimensional designs, the quantity of silicone resin injected into eachmold cavity 710 of the mold 420 may range, for example, from about 1 to150 grams. In a preferred embodiment, for the generation of complicatedthree dimensional designs onto clothing, the quantity of silicone resininjected into each mold ranges from about 1 to 75 grams. The desiredquantity of thermosetting polymer resin selected for injection into eachmold cavity 710 of the mold 420 will vary as a function of theparticular three dimensional design selected for placement upon asubstrate.

The operational steps of selecting the range of permissible contactpressures 2230 and the selection of the quantity of silicone forinjection 2235 may be performed in any order.

After the completion of the initial operational steps of start-up 2205,initiate manifold or cold plate cooling 2210, initiate mold or hot plateheating 2215, initiate platen cooling 2220, initiate platen heating2225, select contact pressure 2230, and select quantity of siliconeresin for injection 2235, the operator then positions and aligns thesubstrate upon the platen 330 and then initiates the molding cycle 2240.

The molding cycle 2240 includes the steps of lowering the die set 2245,starting the injection of silicone resin 2250, checking for injectioncompletion 2255, stopping injection of silicone resin 2260, curing thesilicone resin 2265 and raising the die set 2270. Upon initiating themolding cycle 2240, the silicone resin, or other thermosetting polymerresin, supplies 30 will load one or more silicone resin injectionchambers 2030 of one or more injectors 1650 with the predeterminedquantities of silicone resin, or other thermosetting polymer resin, tobe injected. Alternatively, a mixture of different thermosetting polymerresin supplies may be provided that will permit three dimensional bodiesof a plurality of thermosetting polymer resins of multiple colors to bemolded onto a substrate.

During the step of lowering the die set 2245, the actuator 310controllably lowers the die set 320 into engagement with the garment 340positioned and aligned upon the platen 330. In a preferred embodiment,the operation of the actuator 310 is controlled by the control system40. In a particularly preferred embodiment, the position of the actuator310 as well as the contact pressure of the die set 320 with the garment340 are monitored and controlled by the control system 40. Uponengagement of the die set 320 with the garment 340, the operational stepof injecting silicone resin 2250 begins. For typical articles ofclothing, the contact pressure during engagement with the die set 320may be limited, for example, to the range of 50 to 600 psi in order toprevent damage to the article of clothing 340. In a preferredembodiment, for typical articles of clothing, the contact pressureduring engagement with the die set 320 is limited to the range of 50 to300 psi in order to prevent damage to the article of clothing 340.Alternatively, the permissible range of contact pressure duringengagement with the die set 320 will vary as a function of the type andthickness of the substrate.

During the step of injecting silicone 2250, one or more injectors 1650controllably inject controlled quantities of silicone resin, or someother thermosetting polymer resin, into one or more corresponding moldcavities 710 in order to form one or more three dimensional bodies ofsilicone resin, or some other thermosetting polymer resin. During thestep of injecting silicone resin 2250, the control system 40 continuallychecks to see whether or not the injection of silicone resin has beencompleted in operational step 2255. In a preferred embodiment, the stepof checking to see if the injection of silicone resin has been completed2255 is facilitated by the feedback control of the injectors 1650. Once,the injection of silicone resin into the mold cavities 710 has beencompleted, the injection of silicone resin is stopped in operationalstep 2260. This may be accomplished by stopping the one or more injectoractuators 2050. The operating pressure and flow rate of the siliconeresin injected into the mold cavities 710 may be limited, for example,to the range of about 200 to 800 psi and 0.33 to 0.50 in³ /sec in orderto prevent damage to the article of clothing. In a particularlypreferred embodiment, the operating pressure and flow rate of thesilicone resin injected into the mold cavities 710 are limited to therange of about 300 to 600 psi and 0.01 to 0.33 in³ /sec in order toprevent damage to the article of clothing. Alternatively, the preferredrange of operating pressures and flow rates will vary as a function ofthe type and thickness of the substrate.

During the step of curing the silicone resin 2265, the die set 320 ismaintained in engagement with the article of clothing 340, or othersubstrate, for a predetermined time period in order to permit the heatedmold 420 of the die set 320 to cure the one or more three dimensionalbodies of silicone resin, or some other thermosetting polymer resin, inplace upon the positioned and aligned article of clothing 340, or othersubstrate. For typical types and grades of silicone resin, the curingtime and temperature may range, for example, from approximately 5 to 50seconds and 200 to 500° F. In a preferred embodiment, the curing timeand temperatures range from about 10 to 30 seconds and 300 to 400° F.The curing times and temperatures will vary as a function of theparticular type of thermosetting polymer selected as well as the numberand volume of the mold cavities 710 of the mold 420. Once the siliconeresin, or other thermosetting polymer resin has cured, the die set 320is raised out of engagement with the article of clothing 340, or othersubstrate.

During the step of raising the die set 2270, the actuator 310controllably raises the die set 320 out of engagement with the articleof clothing 340, or other substrate. The control system 40 then waits atoperational step 2240 for the operator to once again initiate themolding cycle.

In a several particularly preferred embodiments, the operational stepsof starting silicone resin injection 2250 and stopping the injection ofsilicone resin 2260 are further facilitated by implementing operationalsteps designed to minimize or prevent the dripping of silicone resin, orsome other thermosetting polymer resin, as described above andillustrated in drawing FIGS. 12a-12e, 13a-13d, and 14a-14b.

Referring to drawing FIGS. 22c and 22d, in one particularly preferredembodiment, the operational steps of starting and stopping the injectionof silicone resin, 2250 and 2260, further include operational stepsdesigned to implement the preferred embodiments of the manifolds 405,425 and 1140 illustrated in drawing FIGS. 12a-12f. In particular, theoperational step of starting the injection of silicone resin 2250further includes the steps of opening the manifold flow control valve2250a and starting the injection of silicone resin 2250b and theoperational step of stopping the injection of silicone resin 2260further includes the steps of closing the manifold flow control valve2260a and stopping the injection of silicone resin 2260b. In thismanner, the flow of silicone resin into the die set 320 can beimmediately stopped as close as possible to the mold 420 itself therebyminimizing or eliminating the flow of excess silicone resin into the diemold 420. In a particularly preferred embodiment, the manifold flowcontrol valves are closed within a time a time period ranging from about125 to 500 msec.

Referring to drawing FIGS. 22e and 22f, in another particularlypreferred embodiment, the operational steps of starting and stopping theinjection of silicone resin, 2250 and 2260, further include operationalsteps designed to implement the preferred embodiment of the moldingdevice 20 illustrated in drawing FIG. 13a. In particular, theoperational step of starting the injection of silicone resin 2250further includes the steps of actuating the manifold flow control valveto select silicone resin injection 2250c and starting the injection ofsilicone resin 2250d and the operational step of stopping the injectionof silicone resin 2260 further includes the steps of actuating themanifold flow control valve to select the exhaust pump 2260c andstopping the injection of silicone resin 2260d. In a particularlypreferred embodiment, the step of selecting the exhaust pump 2260c isperformed for a time duration ranging between about 250 to 6000 msec. inorder to prevent the dripping of silicone resin into the mold 420 of thedie set 320.

Referring to drawing FIGS. 22g and 22h, in another particularlypreferred embodiment, the operational steps of stopping and starting theinjection of silicone resin, 2250 and 2260, further include operationalsteps designed to implement the preferred embodiment of the moldingdevice 20 illustrated in drawing FIGS. 13b-13c. In particular, theoperational step of starting the injection of silicone resin 2250further includes the steps of actuating the manifold flow control valveto deselect the vacuum source 2250e and starting the injection ofsilicone resin 2250f and the operational step of stopping the injectionof silicone resin 2260 further includes the steps of actuating themanifold flow control valve to select the vacuum source 2260e andstopping the injection of silicone resin 2260f. In a particularlypreferred embodiment, the step of selecting the vacuum source 2260e isperformed for a time duration ranging between about 250 to 6000 msec. inorder to prevent the dripping of silicone resin into the mold 420 of thedie set 320.

Referring to drawing FIG. 22i, in another particularly preferredembodiment, the operational step of starting the injection of siliconeresin 2250 further includes operational steps designed to implement thepreferred embodiment of the molding device 20 illustrated in drawingFIGS. 14a and 14b. In particular, the operational step of starting theinjection of silicone resin 2250 further includes the steps of injectingsilicone resin at an elevated pressure and flow rate 2250g and injectingsilicone resin at normal pressures and flow rates 2250h. The step ofinjecting silicone resin at elevated pressures and flow rates 2250g mayinclude injecting silicone resin at pressures ranging, for example, fromabout 101 to 150% of normal values. In a particularly preferredembodiment, the step of injecting silicone resin at elevated pressuresand flow rates 2250g injects silicone resin at pressures ranging fromabout 101 to 120% of normal values. The step of injecting silicone resinat elevated pressures and flow rates 2250g may be performed for timeperiods ranging, for example from about 1 to 10 seconds. In aparticularly preferred embodiment, the step of injecting silicone resinat elevated pressures and flow rates 2250g is performed for time periodsranging from about 1 to 6 seconds. In this manner, silicone resin, orother thermosetting resin material, that may have cured within the flowpassages of the die set 320 is blown out into the cavities 710 of themold 420 for subsequent incorporation into the three dimensional bodiesof silicone.

Referring to drawing FIGS. 22j and 22k, in another particularlypreferred embodiment, the operational steps of stopping and starting theinjection of silicone resin, 2250 and 2260, further include operationalsteps designed to implement the preferred embodiment of the moldingdevice 20 illustrated in drawing FIG. 13d. In particular, theoperational step of starting the injection of silicone resin 2250further includes the steps of actuating the manifold flow control valveto select silicone injection 2250i and starting the injection ofsilicone resin 2250j and the operational step of stopping the injectionof silicone resin 2260 further includes the steps of actuating themanifold flow control valve to select ambient atmospheric pressure 2260gand stopping the injection of silicone resin 2260h. In a particularlypreferred embodiment, the step of selecting ambient atmospheric pressure2260g is performed for a time duration ranging between about 1 to 1000msec. in order to prevent the dripping of silicone resin into the mold420 of the die set 320.

In a particularly preferred embodiment, the operational steps describedabove are all controlled and monitored by the control system 40. In analternative embodiment, the operational steps described above areimplemented using any number of thermosetting polymers including, forexample, silicone, nitrile rubber or urethane. In another alternativeembodiment, the operational steps described above are implemented usinga combination of different thermosetting polymers having similar curingcharacteristics, including such combinations as, for example, silicone,nitrile rubber or urethane and urethane, silicone or nitrile rubber.

Referring to drawing FIGS. 23a-23d, a preferred embodiment of an articleof clothing including one or more three dimensional bodies of silicone,or other thermosetting polymer, 2300 will now be described. The articleof clothing 2300 includes a T-shirt 2305, or other similar garment, suchas, for example, a cap, or purse and at least one three dimensional bodyof silicone, or other thermosetting polymer, 2310 molded onto theT-shirt 2305, or other garment. In a particularly preferred embodiment,as illustrated in drawing FIG. 23a, the article of clothing 2300includes a plurality of three dimensional bodies of silicone, or otherthermosetting polymers, 2310a-2310c. In a particularly preferredembodiment, the three dimensional bodies of silicone, or otherthermosetting polymers, 2310 are molded onto the T-shirt 2305, or othergarment, using the apparatus 10 and accompanying methods describedabove. In this manner, a plurality of multi-colored three dimensionalbodies of silicone can be molded onto a plurality of T-shirts 2305, orother garments, substantially simultaneously. More generally, theT-shirt 2305, or other garment, may comprise any substrate and aplurality of three dimensional multi-colored bodies of the same ordifferent thermosetting polymers may be molded onto the substrate usingthe apparatus 10 and accompanying methods described above.

As illustrated in drawing FIGS. 23b and 23c, the three dimensionalbodies of silicone 2310, or some other thermosetting polymer, arepreferably molded onto a T-shirt 2305, or some other substrate, bypermeating the fibers 2315 of the T-shirt 2305, or some other garment orsubstrate. In this manner, the three dimensional bodies of silicone2310, or some other thermosetting polymer, are permanently affixed tothe T-shirt 2305, or some other garment or substrate. In a particularlypreferred embodiment, as illustrated in drawing FIGS. 23c and 23d, askim coating 2320 of cured silicone resin, or some other thermosettingpolymer resin, is also formed on the inside surface 2325 of the fabric2330 of the T-shirt 2305, or some other garment or substrate. In apreferred embodiment, the skim coating 2320 is formed within the fabric2330 of the article of clothing 2305 before reaching the inside surface2325 of the fabric 2330 of the article of clothing 2305. In this manner,the skin of the wearer of the article of clothing 2305 will only contactthe smooth fabric surface. As discussed above, the skim coating 2320 ispreferably formed by curing the silicone resin, or some otherthermosetting polymer resin, using the heated portion of the platen 330of the molding device 20 during the molding process.

In a particularly preferred embodiment, one or more of the threedimensional bodies of silicone, or some other thermosetting polymer,2310 will further include at least one encapsulated element 2335 suchas, for example, a beeper, liquid crystal display, hologram, or otherdevice. In a particularly preferred embodiment, the encapsulated device2335 is a computer chip, granular fill material, paper or cardboard.

Referring now to drawing FIGS. 24, 25a, 25b, 26a, 27a, 28a, 29a, 30a,and 31a, a preferred embodiment of a method for fabricating an articleof clothing 2300 including at least one three dimensional body ofsilicone, or some other thermosetting polymer, 2310 having at least oneencapsulated element 2335 will be described. As illustrated in drawingFIG. 31a, the method of fabricating an article of clothing 2300including at least one three dimensional body of silicone, or some otherthermosetting polymer, 2310 having at least one encapsulated element2335 preferably includes the steps of: forming a primary body ofsilicone, or some other thermosetting polymer, including at least onecavity 3105, forming a skim coating of silicone, or some otherthermosetting polymer, within a mold cavity for a secondary body 3110,placing the element to be encapsulated into the mold cavity for thesecondary body 3115, encapsulating the element in silicone, or someother thermosetting polymer, within the secondary body mold cavity 3120,curing the secondary body of silicone, or some other thermosettingpolymer, including the encapsulated element 3125, removing the curedsecondary body from the mold cavity and applying an adhesion promoter tothe outside surface of the secondary body that will contact the cavityof the primary body 3130, and placing the secondary body within thecavity of the primary body and allowing the secondary body to bond tothe primary body 3135. Alternatively, the steps performed in fabricatingan article of clothing 2300 including at least one three dimensionalbody of silicone 2310 having at least one encapsulated element 2335 maybe utilized to provide an article of clothing including at least onebody of a thermosetting polymer having an encapsulated element.

In operational step 3105, as illustrated in drawing FIG. 24, a threedimensional body 2310 of silicone, or some other thermosetting polymer,including a cavity 2405 is formed onto a t-shirt 2305, or some othergarment or substrate, preferably using the apparatus 10 and accompanyingmethods described above. The cavity 2405 may be provided in the threedimensional body 2310 by providing an appropriate mold cavity as will berecognized by persons having ordinary skill in the art. In a preferredembodiment, the cavity 2405 is provided on an upper surface of the body2310 to facilitate subsequent encapsulation of the element 2335. Thethree dimensional body 2310 is preferably formed using the preferredembodiments for molding three dimensional bodies of thermosettingpolymers onto substrates discussed above.

In operational step 3110, as illustrated in drawing FIGS. 25a and 25b, askim coating of silicone, or some other thermosetting polymer, 2505 isformed on the surface 2510 of a mold cavity 2515 of a mold 2520 for asecondary body. The skim coating of silicone, or some otherthermosetting polymer, 2505 may be formed by providing a supply ofsilicone resin, or some other thermosetting polymer resin, 2525 that isinjected onto the surface of the mold cavity 2515 by an injector 2530.

The supply of silicone resin, or some other thermosetting polymer resin,2525 is preferably formed using a color block 2535 that injects apigment into a supply of materials A and B that are pumped to the colorblock 2535 by pumps A and B, 2540 and 2545. In an alternativeembodiment, and more generally, for a thermosetting polymer, materialsA, B, . . . C, D, E . . . etc . . . may be mixed in the color block 2535with a pigment to form a colored thermosetting polymer. In aparticularly preferred embodiment, the operation, design and control ofthe injector 2530, color block 2535, and pumps 2540 and 2545 aresubstantially as described above for the apparatus 10. The color block2535 may inject a pigment to provide a colored silicone resin forsubsequent injection and encapsulation of the element 2335. In analternative preferred embodiment, a substantially transparent siliconeresin, or some other thermosetting polymer resin, is injected into thesecondary body mold cavity 2515 to facilitate subsequent viewing of theencapsulated element 2335.

The skim coating 2505 may be formed by applying a substantially uniformthin coating of silicone resin, or some other thermosetting polymerresin, onto the surface 2510 of the mold cavity 2515. In a preferredembodiment, the skim coating 2505 is formed by applying a substantiallyuniform coating of silicone resin, or some other thermosetting polymerresin, onto the surface 2510 of the mold cavity 2515 ranging inthickness from about 0.50 to 2 millimeters. The skim coating 2505 ofsilicone resin, or some other thermosetting polymer resin, may then becured in a conventional manner using a combination of time andtemperature. In a preferred embodiment, the skim coating 2505 ofsilicone resin is cured for about 3 minutes at a temperature of about75° F. Alternatively, more generally, the preferred time and temperaturefor curing will vary as a function of the particular thermosettingpolymer.

In operational step 3115, as illustrated in drawing FIG. 26a, theelement 2335 is placed into the mold cavity 2515 onto the skim coating2505 of silicone, or some other thermosetting polymer. In a preferredembodiment, the outer surface of the element 2335 is throughly cleanedof substantially all foreign material and dried prior to placementwithin the mold cavity 2515 to facilitate the subsequent encapsulationprocess. In a particularly preferred embodiment, the element 2335 isplaced in the approximate center of the mold cavity 2515 to facilitatethe subsequent encapsulation process.

In operational step 3120, as illustrated in drawing FIG. 27a, theelement 2335 is encapsulated with silicone resin, or some otherthermosetting polymer resin, within the mold cavity 2515 to form asecondary body 2705 having an encapsulated element. The element 2335 maybe encapsulated within the secondary body by injecting a controlledquantity of silicone resin, or some other thermosetting polymer resin,into the mold cavity 2515 using the injector 2530.

In operational step 3125, the secondary body 2705 including theencapsulated element 2335 is cured within the mold cavity 2515 in aknown manner using a combination of time and temperature. In a preferredembodiment, the secondary body 2705 is cured within the mold cavity fora time period ranging from about 15 to 50 seconds at temperaturesranging from about 200 to 500° F in order to prevent thermal damage tothe encapsulated element 2335. For clear silicone, curing at roomtemperature is effected in about 2 to 4 minutes.

In operational step 3130, as illustrated in drawing FIG. 28a, thesecondary body 2705 is removed from the mold cavity 2515 and an adhesionpromoter 2805 is applied to an outer surface of the secondary body 2705that will contact the surfaces of the cavity 2405 formed in the primarysilicone, or some other thermosetting polymer, body 2310. The adhesionpromoter 2805 may be applied in a substantially uniform coating over theouter surface of the secondary body 2705 that will contact the surfacesof the cavity 2405 formed in the primary body 2310. In a preferredembodiment, a substantially uniform coating ranging in thickness fromabout 0.040 to 0.125 inches is applied over the outer surface of thesecondary body 2705 that will contact the surfaces of the cavity 2405formed in the primary body 2310. The adhesion promoter 2805 may compriseany number of conventional commercially available adhesion promoters forsilicone, or other thermosetting polymers, materials. In a preferredembodiment, the adhesion promoter 2805 is optimized for siliconematerials and is a part no. AP 546 available from General Electric,Silicone Products Division in Waterford, N.Y.

In operational step 3135, as illustrated in drawing FIGS. 29a and 30a,the secondary body 2705 is placed within the cavity 2405 of the primarybody 2310. The secondary body 2705 is then allowed to bond to theprimary body 2310. The resulting three dimensional body of silicone, orsome other thermosetting polymer, 2310 includes an encapsulated element2335 that is itself encapsulated within a secondary body 2705. Theprimary and secondary bodies 2310 and 2705 may or may not be comprisedof the same color of silicone, or some other thermosetting polymer. In apreferred embodiment, the primary body 2310 is comprised of a coloredsilicone and the secondary body 2705 is comprised of a substantiallyclear silicone to facilitate the viewing of the encapsulated element bya person.

In an alternative preferred embodiment, as illustrated in drawing FIG.32a, a method for fabricating an article of clothing 2300 including atleast one three dimensional body of silicone, or some otherthermosetting polymer, 2310 having at least one encapsulated element2335 includes the operational steps of: forming a primary body ofsilicone, or some other thermosetting polymer, including at least onecavity 3205, placing the element to be encapsulated into the cavity ofthe primary body 3210, encapsulating the element in silicone, or someother thermosetting polymer, within the primary body cavity 3215, andcuring the primary body of silicone, or some other thermosettingpolymer, including the encapsulated element 3220.

In the alternative preferred embodiment illustrated in drawing FIG. 32a,the curing time and temperature required to encapsulate the element 2335within the cavity 2405 of the primary body of silicone, or some otherthermosetting polymer, 2310 are adjusted to prevent damage to thepreexisting primary body of silicone, or some other thermosettingpolymer, 2310. In a particularly preferred embodiment, the curing timeis lengthened and the curing temperature are lowered.

In another alternative embodiment, as illustrated in drawing FIGS.33a-33b, a three dimensional body of silicone, or some otherthermosetting polymer, 3305 including encapsulated elements 3310 may beformed upon a substrate 3315, such an article of clothing, byintroducing the encapsulated elements during the molding process. Theelements 3310 may be provided by provided by providing an additionalinlet 3320 for the mold cavity 3325 to permit the introduction of theelements 3310. In a preferred embodiment, the elements 3310 areintroduced into the inlet 3320 by feed a supply of elements 3330 into aflow path 3335 of a blower 3340, or other similar device that is coupledto the inlet 3320. In this manner, the elements 3310 may be encapsulatedsimultaneously with the molding of the three dimensional body 3305 ontothe article of clothing 3315. In a particularly preferred embodiment,the molding of the three dimensional body 3305 is otherwise providedusing the apparatus and methods described above.

A method and apparatus for molding three dimensional bodies of silicone,or some other thermosetting polymer, onto articles of clothing, or othersubstrates, has been described. The method and apparatus further permitsa plurality of three dimensional bodies of silicone, or some otherthermosetting polymer, that are of a plurality of colors onto an articleof clothing, or other substrates. The method and apparatus furtherpermits a plurality of such three dimensional bodies to be molded onto aplurality of substrates substantially simultaneously. The method andapparatus may be generally applied to the molding of three dimensionalbodies of thermosetting polymers onto substrates. The method andapparatus may be further applied to form a plurality of threedimensional bodies of a plurality of types of thermosetting polymersonto substrates.

A molding device has been described for molding three dimensional bodiesof silicone, or some other thermosetting polymer, onto an article ofclothing, or some other substrate. The molding device permits at leastone three dimensional body of silicone, or some other thermosettingpolymer, to be molded onto an article of clothing, or some othersubstrate. More generally, the molding device may be used to mold anythermosetting polymer onto a substrate. More generally still, themolding device may be used to mold a plurality of different types ofthermosetting polymers onto a substrate. The molding device may beadapted to incorporate a number of elements to minimize the curingand/or dripping of silicone resin, or other thermosetting polymerresins, within the die set of the molding device. The molding device maybe generally applied to the molding of three dimensional bodies ofthermosetting polymers onto substrates.

A die set has been described that provides an input member, thermalisolation, and a mold for use in a molding device. The die set may beutilized to mold and cure three dimensional bodies of silicone, or otherthermosetting polymers, onto substrates.

A silicone resin supply has been described that provides a plurality ofsupplies of silicone resin, or some other thermosetting polymer resin,for subsequent injection into at least one molding device.

A method and apparatus for encapsulating elements within threedimensional bodies of silicone, or some other thermosetting polymer, hasbeen described that permits at least one element to be encapsulated intoa three dimensional body of silicone, or some other thermosettingpolymer.

The method and apparatus described herein may be used to create articlesof clothing, or some other substrate, having at least one threedimensional body of silicone, or some other thermosetting polymer. Themethod and apparatus described herein may further be used to createarticles of clothing, or some other substrate, having at least one threedimensional body of silicone, or some other thermosetting polymer, thatfurther includes at least one encapsulated element.

While described in the form of preferred embodiments for molding threedimensional bodies of silicone, with and without encapsulated elements,the teachings of the present disclosure will find broad application tomolding three dimensional bodies of thermosetting polymers, with andwithout encapsulated elements, onto substrates generally.

What is claimed is:
 1. A molding device for molding thermosettingpolymer bodies onto substrates, comprising:a die set adapted to mold atleast one of said bodies onto at least one of said substrates; a platenadapted to support and position said at least one substrate relative tosaid die set; an actuator adapted to move said die set into and out ofengagement with said at least one substrate wherein said actuatorcontrollably actuates said die set into engagement with said at leastone substrate as a function of a contact pressure between said die setand said substrate; and a control system operably coupled to said dieset, said platen and said actuator and adapted to control the operationof said molding device.
 2. The molding device of claim 1, wherein saiddie set is adapted to receive a plurality of supplies of said polymer.3. The molding device of claim 1, wherein said die set includes aheating element adapted to controllably maintain a portion of said dieset within a predetermined range of temperatures.
 4. The molding deviceof claim 1, wherein said die set includes a cooling element adapted tomaintain a portion of said die set within a predetermined range oftemperatures.
 5. The molding device of claim 1, wherein said die setincludes:a heating element adapted to controllably maintain a portion ofsaid die set within a predetermined range of temperatures; and a coolingelement adapted to controllably maintain another portion of said die setwithin another predetermined range of temperatures.
 6. The moldingdevice of claim 1, wherein said platen includes a heating elementadapted to controllably maintain a portion of said platen within apredetermined range of temperatures.
 7. The molding device of claim 6,wherein said heating element of said platen is in opposing relation tosaid die set during engagement of said die set with said one of said atleast one substrate.
 8. A molding device for molding thermosettingpolymer bodies onto substrates, comprising:a die set adapted to mold atleast one of said bodies onto at least one of said substrates: a platenadapted to support and position said at least one substrate relative tosaid die set wherein said platen includes a cooling element adapted tocontrollably maintain a portion of said platen within a predeterminedrange of temperatures; an actuator adapted to move said die set into andout of engagement with said at least one substrate; and a control systemoperably coupled to said die set, said platen and said actuator andadapted to control the operation of said molding device.
 9. A moldingdevice for molding thermosetting polymer bodies onto substrates,comprising:a die set adapted to mold at least one of said bodies onto atleast one of said substrates; a platen adapted to support and positionsaid at least one substrate relative to said die set wherein said platenincludes;a heating element adapted to controllably maintain a portion ofsaid platen within a predetermined range of temperatures; and a coolingelement adapted to controllably maintain another portion of said platenwithin another predetermined range of temperatures; and an actuatoradapted to move said die set into and out of engagement with said atleast one substrate; and a control system operably coupled to said dieset, said platen and said actuator and adapted to control the operationof said molding device.
 10. A molding device for molding thermosettingpolymer bodies onto substrates, comprising:a die set adapted to mold atleast one of said bodies onto at least one of said substrates; a platenadapted to support and position said at least one substrate relative tosaid die set wherein said platen further includes a guiding memberadapted to guide said platen into and out of a position in opposingrelation to said die set; an actuator adapted to move said die set intoand out of engagement with said at least one substrate; and a controlsystem operably coupled to said die set, said platen and said actuatorand adapted to control the operation of said molding device.
 11. Amolding device for molding thermosetting polymer bodies onto substrates,comprising:a die set adapted to mold at least one of said bodies onto atleast one of said substrates wherein said die set includes;an inputmember adapted to receive and distribute said at least one supply ofsaid polymer; a mold including at least one cavity coupled to said inputmember and adapted to receive said distribution of said at least onesupply of said polymer and mold said at least one supply of said polymeronto said at least one substrate to form at least one three dimensionalbody of said polymer; and at least one resilient member coupled betweensaid input member and said mold; and a platen adapted to support andposition said at least one substrate relative to said die set; anactuator adapted to move said die set into and out of engagement withsaid at least one substrate; and a control system operably coupled tosaid die set, said platen and said actuator and adapted to control theoperation of said molding device.
 12. The molding device of claim 11,wherein said input member is adapted to receive and distribute aplurality of supplies of said polymer, and wherein said mold includes aplurality of cavities and is adapted to receive said distribution ofsaid plurality of supplies of said polymer and mold said plurality ofsupplies of said polymer onto said at least one substrate to form aplurality of three dimensional bodies of said polymer.
 13. The moldingdevice of claim 11, wherein said die set further includes at least onethermal isolation element coupled between said input member and saidmold.
 14. The molding device of claim 11, wherein said die set furtherincludes a thermal insulating plate coupled between said input memberand said mold.
 15. The molding device of claim 11, wherein said inputmember includes a cooling element adapted to maintain a temperature ofsaid input member within a predetermined range of temperatures.
 16. Themolding device of claim 11, wherein said input member includes at leastone flow control valve adapted to controllably couple said input memberto one of said at least one supplies of said polymer.
 17. The moldingdevice of claim 16, wherein said flow control valve is a rotary valve.18. The molding device of claim 11, wherein said input member includesat least one selection valve adapted to controllably couple said inputmember to either one of said at least one supplies of said polymer or apressure sink.
 19. The molding device of claim 11, wherein said inputmember includes at least one selection valve adapted to controllablycouple said input member to a vacuum source.
 20. The molding device ofclaim 11, wherein said input member includes at least one nozzle adaptedto cooperatively interact with and distribute said at least one supplyof said polymer to said mold.
 21. The molding device of claim 20,wherein said at least one nozzle includes a thermal insulating member.22. The molding device of claim 11, wherein said die set furtherincludes a thermal insulating plate coupled between said input memberand said mold.
 23. The molding device of claim 11, wherein said moldincludes a heating member adapted to controllably maintain a temperatureof said mold within a predetermined range of temperatures.
 24. Themolding device of claim 11, wherein said at least one mold cavity is atleast partially defined by a portion extending outward from said mold.25. The molding device of claim 11, wherein said input membercomprises:a manifold adapted to receive said at least one supply of saidpolymer; and a runner plate coupled to said manifold and adapted todistribute said at least one supply of said polymer.
 26. The moldingdevice of claim 1, wherein said at least one supply of polymer comprisesa supply of a first polymer and a supply of a second polymer.
 27. Themolding device of claim 1, wherein said apparatus is adapted to mold aplurality of three dimensional bodies of thermosetting polymer onto aplurality of substrates substantially simultaneously.
 28. The moldingdevice of claim 1, wherein said apparatus is adapted to mold a pluralityof three dimensional bodies of thermosetting polymer onto a substrateusing a plurality of different types of thermosetting polymers.
 29. Aplaten for use in a molding device for molding at least one threedimensional body of a thermosetting polymer onto a substrate, saidplaten adapted to support said substrate during molding of said at leastone three dimensional body onto said substrate, said platen comprising:aplaten body including:a supporting member adapted to support saidsubstrate; a positioning member coupled to said supporting member andadapted to position said substrate; a heating element coupled to saidsupporting member and adapted to heat a region of said substrate; and acooling element coupled to said supporting member and adapted to coolanother region of said substrate.
 30. The platen of claim 29, furthercomprising a temperature sensor operably coupled to said heating elementadapted to generate a signal representative of an operating temperatureof said heating element.
 31. The platen of claim 29, wherein saidheating element comprises an electric heating element and wherein saidcooling element comprises a fluidic cooling element.
 32. The platen ofclaim 29, wherein said cooling element substantially surrounds saidheating element.
 33. The platen of claim 32, wherein said platen furtherincludes an insulating member coupled between said heating element andsaid cooling element.
 34. The platen of claim 29, wherein said platenfurther comprises:a guiding member adapted to permit said platen to bemoved into and out of a reference position for molding.
 35. A method formolding thermosetting polymer bodies onto substrates,comprising:adapting a die set to mold at least one of said bodies ontoat least one of said substrates; adapting a platen to support andposition said at least one substrate relative to said die set; adaptingan actuator to move said die set into and out of engagement with said atleast one substrate wherein said actuator controllably actuates said dieset into engagement with said at least one substrate as a function of acontact pressure between said die set and said substrate; coupling acontrol system operably to the die set, said platen and said actuatorwherein said control system is adapted to control the operation of saiddie set, said platen and said actuator; positioning said at least onesubstrate on said platen; injecting said polymer into a mold of said dieset to form at least one of said polymer bodies; and curing said polymeron said substrate.
 36. The method of claim 35, furthercomprising:adapting said die set to receive a plurality of supplies ofsaid polymer.
 37. The method of claim 35, further comprising:adapting aheating element to controllably maintain a portion of said die setwithin a predetermined range of temperatures.
 38. The method of claim35, further comprising:adapting a cooling element to controllablymaintain a portion of said die set within a predetermined range oftemperatures.
 39. The method of claim 35, further comprising:adapting aheating element to controllably maintain a portion of said platen withina predetermined range of temperatures.
 40. A method for moldingthermosetting polymer bodies onto substrates, comprising:adapting a dieset to mold at least one of said bodies onto at least one of saidsubstrates; adapting a platen to support and position said at least onesubstrate relative to said die set, including; adapting a coolingelement to controllably maintain a portion of said platen within apredetermined range of temperatures; adapting an actuator to move saiddie set into and out of engagement with said at least one substrate;coupling a control system operably to the die set, said platen and saidactuator wherein said control system is adapted to control the operationof said die set, said platen and said actuator; positioning said atleast one substrate on said platen; injecting said polymer into a moldof said die set to form at least one of said polymer bodies; and curingsaid polymer on said substrate.
 41. A method for molding thermosettingpolymer bodies onto substrates, comprising:adapting a die set to mold atleast one of said bodies onto at least one of said substrates; adaptinga platen to support and position said at least one substrate relative tosaid die set, including;adapting a heating element to controllablymaintain a portion of said platen within a predetermined range oftemperatures; and adapting a cooling element to controllably maintainanother portion of said platen within a predetermined range oftemperatures; adapting an actuator to move said die set into and out ofengagement with said at least one substrate; coupling a control systemoperably to the die set, said platen and said actuator wherein saidcontrol system is adapted to control the operation of said die set, saidplaten and said actuator; positioning said at least one substrate onsaid platen; injecting said polymer into a mold of said die set to format least one of said polymer bodies; and curing said polymer on saidsubstrate.
 42. A method for molding thermosetting polymer bodies ontosubstrates, comprising:adapting a die set to mold at least one of saidbodies onto at least one of said substrates; adapting a platen tosupport and position said at least one substrate relative to said dieset; adapting a guiding member to guide said platen into and out of aposition in opposing relation to said die set; adapting an actuator tomove said die set into and out of engagement with said at least onesubstrate; coupling a control system operably to said die set, saidplaten and said actuator wherein said control system is adapted tocontrol the operation of said die set, said platen and said actuator;positioning said at least one substrate on said platen; injecting saidpolymer into a mold of said die set to form at least one of said polymerbodies; and curing said polymer on said substrate.